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Mustar Custom PCBA Manufacturer
US$0.90 / Piece
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What is Mustar Custom PCBA Automotive PCB PCBA Circuit Electronic Board Assembly

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.90 / Piece

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Aluminum Covered Copper Foil Layer
  • Application Medical Instruments
  • Flame Retardant Properties Other
  • Mechanical Rigid Other
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Other
  • Board Thickness 1.6mm
  • PCB Max Panel Size 1190*350mm/450*450mm

Product Description

Recommended by seller Product Paramenters Material FR4, (High Tg FR4,General Tg FR4,Middle Tg FR4),Lead-Free Solder Sheet,Halogen Free FR4, Ceramic Filling Material,PI Material,BT Material,PPO,PPE etc. Board Thickness 0.11-0.5mm Max.Copper Thickness 4OZ Layer ...

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Mustar Custom PCBA Manufacturer Comparison
Transaction Info
Price US$0.90 / Piece US$0.10-1.00 / Piece US$0.10-6.00 / Piece US$0.10 / Piece US$0.01-5.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 88,888 Pieces 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union T/T, PayPal LC, T/T, PayPal, Western Union
Quality Control
Product Certification - UL,ISO9001&ISO14001,SGS,RoHS,Ts16949 - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Medical Instruments;
Flame Retardant Properties: Other;
Mechanical Rigid: Other;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Other;
Board Thickness: 1.6mm;
PCB Max Panel Size: 1190*350mm/450*450mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Special Process: Stiffeners etc;
Copper Thickness: 0.5-8oz;
Enig Thickness: 1-3u'';
Hard Gold Thickness: 5-50u'';
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green / Black / Blue / Red / Yellow;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 0.8mm / 1.6mm / 2.0mm Custom;
Custom: OEM / ODM;
Copper: 0.5oz / 18um, 2oz / 70um;
Layers: 1~20 Layers;
Legend: White;
Surface Finish: L-F HASL / Enig / OSP;
Oovp: Yes;
Oscp: Yes;
Otp: Yes;
Size: 115*96*39mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper ,PP;
Insulation Materials: Epoxy Resin;
Brand: Kb,Shenyi,Rogers,Iteq;
Layer: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Outline Tolerance: +0.10mm;
Minimum Line/ Space: 0.075mm;
Impedance Control Tolerance: +/-10%;
Supplier Name

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen XC-ESC Technology Co., Ltd.

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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