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PCBA
US$5.00 / Piece
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What is Mu Star High Precision PCB Assembly with Full Testing for Automotive Industry PCBA

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$5.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Complex
  • Application Medical Instruments
  • Flame Retardant Properties V2
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Transport Package ESD Bag/ Bubble Package
  • Specification Customized
  • Trademark Mu Star
  • Origin China
  • Certificate ISO9001/Ts16949/RoHS/Ts16949
  • Color Customized
  • Testing Service Aoi/ X-ray/ Fai
  • Board Thickness 1.6mm
  • Number of Layers 1-58 Layers

Product Description

One-stop PCB/PCBA/BOM service Mu Star (Shenzhen) Industry Co., Ltd. Focuses on One-stop PCBA manufacturing service Since 1998. We have rich experience on customize Medical &Automotive &New Energy field. We cooperated with 50 famous brand customer over $2,000,000 per year. Mu Star has factory ...

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PCBA Comparison
Transaction Info
Price US$5.00 / Piece US$0.10-80.00 / Piece US$0.10-80.00 / Piece US$0.10-80.00 / Piece US$0.10-80.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification ISO9001/Ts16949/RoHS/Ts16949 UL,ISO9001&ISO14001,SGS,RoHS,Ts16949 UL,ISO9001&ISO14001,SGS,RoHS Report UL,ISO9001&ISO14001,SGS,RoHS,Ts16949 UL,ISO9001&ISO14001,SGS,RoHS Report
Management System Certification - - - - -
Trade Capacity
Export Markets North America North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Color: Customized;
Testing Service: Aoi/ X-ray/ Fai;
Board Thickness: 1.6mm;
Number of Layers: 1-58 Layers;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Layers: 1-20layers;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Conformal Coating: Epoxy Resin;
Pth Wall: 20um;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Enig Thickness: 1-3u'';
Hard Gold Thickness: 5-50u'';
Layer: 1-20layers;
Supplier Name

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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