| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Mustar;
D/C: Standard;
Condition: New Original;
Warranty: 2 Years;
Mountng Type: SMT ,DIP;
Memory Type: Standard;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: N/a;
Remark: PCB Board;
Layer: 4;
Surface Finish: Immersion Gold;
Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers;
Board Thickness: 0.20mm-8.00mm;
Min Line: 0.075mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Remark: PCB Board;
Layer: 6;
Surface Finish: HASL;
Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers;
Board Thickness: 0.20mm-8.00mm;
Min Line: 0.075mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Remark: PCB Board;
Layer: 4;
Surface Finish: HASL;
Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers;
Board Thickness: 0.20mm-8.00mm;
Min Line: 0.075mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Remark: PCB Board;
Layer: 6;
Surface Finish: HASL;
Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers;
Board Thickness: 0.20mm-8.00mm;
Min Line: 0.075mm;
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