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PCBA
US$0.50-1.00 / Piece
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What is High-Quality PCB Assembly Services 2-12 Layers Thick SMT DIP Board Assembly

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-49 Pieces US$1.00

50-99 Pieces US$0.80

100-499 Pieces US$0.70

500-999 Pieces US$0.60

1,000+ Pieces US$0.50

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand Mustar
  • Transport Package Carton
  • Specification oem
  • Trademark Mustar
  • Origin Shen Zhen
  • D/C Standard
  • Condition New Original
  • Warranty 2 Years
  • Mountng Type SMT ,DIP
  • Memory Type Standard

Product Description

Category Details Company Name Mu Star (Shenzhen) Industry Co., LTD Advantages - Testing &Packaging Program and functional test and package for free Advantages - Quality Standard IPC - A - 610E standard, E - test, X - ray, AOI test, QC, 100% functional test Advantages - Professional Services ...

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PCBA Comparison
Transaction Info
Price US$0.50-1.00 / Piece US$0.20-0.60 / Piece US$0.0001-0.10 / Piece US$50.00-1,000.00 / Piece US$0.20-0.60 / Piece
Min Order 10 Pieces 1 Piece 1 Piece 10 Pieces 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union LC, T/T LC, T/T, D/P, PayPal T/T, PayPal, Western Union
Quality Control
Product Certification - - N/a CE ISO90001 -
Management System Certification - - - ISO9001:2015, ISO45001:2018, ISO14001 -
Trade Capacity
Export Markets North America North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM Own Brand, ODM Own Brand, ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Mustar;
D/C: Standard;
Condition: New Original;
Warranty: 2 Years;
Mountng Type: SMT ,DIP;
Memory Type: Standard;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free,;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Material: N/a;
Encapsulation Structure: N/a;
Installation: N/a;
Working Frequency: N/a;
Power Level: N/a;
Function: N/a;
Structure: N/a;
Color: Blue;
Type: Blue;
Function: Automatic Control;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free,;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Supplier Name

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

ShenZhen Nova Semiconductor Co., Ltd.

Diamond Member Audited Supplier

Beijing Fuanshi Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

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