| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
|
Metal Coating: Copper;
Mode of Production: SMT, DIP, Manual Welding, etc.;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Min. SMD Size: 01005;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Service: Turnkey Assembly PCB PCBA Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Controlling Range: -40c~125c;
Application: Electronic Products;
Quality Standard: Ipc 610 Class II/Ipc 610 Class III;
PCB Handling Size: 2*2cm up to 40*31cm;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion;
BGA Placement: Down to 0.35mm;
SMT Capability: Over 115000 Solder Joints Per Hour Average;
|
Metal Coating: Copper;
Mode of Production: SMT, DIP, Manual Welding, etc.;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Min. SMD Size: 01005;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Service: Turnkey Assembly PCB PCBA Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Controlling Range: -40c~125c;
Application: Electronic Products;
Quality Standard: Ipc 610 Class II/Ipc 610 Class III;
PCB Handling Size: 2*2cm up to 40*31cm;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion;
BGA Placement: Down to 0.35mm;
SMT Capability: Over 115000 Solder Joints Per Hour Average;
|
Metal Coating: Copper;
Mode of Production: SMT, DIP, Manual Welding, etc.;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Min. SMD Size: 01005;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Service: Turnkey Assembly PCB PCBA Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Controlling Range: -40c~125c;
Application: Electronic Products;
Quality Standard: Ipc 610 Class II/Ipc 610 Class III;
PCB Handling Size: 2*2cm up to 40*31cm;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion;
BGA Placement: Down to 0.35mm;
SMT Capability: Over 115000 Solder Joints Per Hour Average;
|
Metal Coating: Copper;
Mode of Production: SMT, DIP, Manual Welding, etc.;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Min. SMD Size: 01005;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Service: Turnkey Assembly PCB PCBA Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Controlling Range: -40c~125c;
Application: Electronic Products;
Quality Standard: Ipc 610 Class II/Ipc 610 Class III;
PCB Handling Size: 2*2cm up to 40*31cm;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion;
BGA Placement: Down to 0.35mm;
SMT Capability: Over 115000 Solder Joints Per Hour Average;
|
