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Die Attach Machine
US$170,000.00-190,000.00 / Set
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What is Advanced Semiconductor Packaging Equipment Accuracy 1um Gantry Multi Needle Nozzle Replacement Die Sorter Die Sorting Attach Machine

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Set US$170,000.00-190,000.00 / Set

Sepcifications

  • After-sales Service 1 Year
  • Condition New
  • Speed High Speed
  • Precision High Precision
  • Certification CE
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Type High-speed Chip Mounter
  • Transport Package Wooden Case
  • Trademark minder-hightech
  • Origin China

Product Description

Fully automatic high-precision Dispensing Machine and Die bonding machine The fully automatic high-precision Dispensing Machine and Die bonding machine are key equipment for post packaging that can be combined online, with a positioning accuracy of+/-3um. The machine adopts advanced motion control ...

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Die Attach Machine Comparison
Transaction Info
Price US$170,000.00-190,000.00 / Set US$85,000.00 / Piece US$85,000.00 / Piece US$120,000.00 / Piece US$120,000.00 / Piece
Min Order 1 Set 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T T/T, D/P, PayPal, Western Union, LC T/T, D/P, PayPal, Western Union, LC T/T, D/P, PayPal, Western Union, LC T/T, D/P, PayPal, Western Union, LC
Quality Control
Product Certification CE CE CE CE CE
Management System Certification - - - - -
Trade Capacity
Export Markets North America, Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
After-sales Service: 1 Year;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
After-sales Service: Support;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Spi 8030-2: Automatic Inspecting Machine;
Auto-Verification: Ksmart Solutions;
Detection Capability: 01005;
Track Adjustment: Automatic;
After-sales Service: Support;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Spi 8030-2: Automatic Inspecting Machine;
Auto-Verification: Ksmart Solutions;
Detection Capability: 01005;
Track Adjustment: Automatic;
After-sales Service: Support;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Maximum: 5mm;
Minimum: 0201/03015;
Component Height: 3mm/25mm;
Lx-8: High;
After-sales Service: Support;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Maximum: 5mm;
Minimum: 0201/03015;
Component Height: 3mm/25mm;
Lx-8: High;
Supplier Name

Guangzhou Minder-Hightech co.,Ltd

Diamond Member Audited Supplier

Shenzhen BOYU Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen BOYU Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen BOYU Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen BOYU Electronic Technology Co., Ltd

Gold Member Audited Supplier

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