Min. Order Reference FOB Price
1 Piece US$999.00-99,999.00 / Piece
Product Description
Wafer Cleaving Equipment Application: Application of III-V compound semiconductor materials, GaAS/II-V RFIC, Bio-Medical Chips, Silicon/MEMS, Sl Photonics, LEDS, Laser Diodes. Suitable for compound semiconductor wafer materials such as GaAs, InP, etc. with a size of 6 inches or less, ...