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ESD Packing Tray
US$5.60-8.70 / Piece
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What is Durable and Quality ESD Plastic Blister Packing

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-199 Pieces US$8.70

200-299 Pieces US$6.30

300+ Pieces US$5.60

Sepcifications

  • Certification CE, ISO, RoHS
  • Type Package Material
  • Usage Combustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line
  • Transport Package Carton and Pallet
  • Specification Customized
  • Trademark LEENOL
  • Origin China
  • Resistabce 10e9-10e11ohms
  • Resistabce1 10e6-10e8ohms
  • Resistabce2 10e3-10e5ohms
  • Condition New
  • Waterproof Waterproof
  • Material Plastic

Product Description

ESD Plastic tray blister packing for electronic Using advanced Blister vacuum forming machine, It makes the blister packing quality stable and keep production data as well.Based on advanced technology, we could offer professional vacuum packing for electronics factories, medical and cleanrooms. ...

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ESD Packing Tray Comparison
Transaction Info
Price US$5.60-8.70 / Piece US$0.022-0.99 / Piece US$0.01-0.06 / Piece US$0.01-0.06 / Piece US$0.02-0.10 / Piece
Min Order 100 Pieces 10,000 Pieces 3,000 Pieces 3,000 Pieces 5,000 Pieces
Payment Terms LC, T/T, PayPal, Western Union, Money Gram LC, T/T, D/P, PayPal, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification CE, ISO, RoHS ISO9001, RoHS, SGS - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Southeast Asia, Eastern Asia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Package Material;
Usage: Combustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line;
Resistabce: 10e9-10e11ohms;
Resistabce1: 10e6-10e8ohms;
Resistabce2: 10e3-10e5ohms;
Condition: New;
Waterproof: Waterproof;
Material: Plastic;
Type: Bag;
Usage: Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line;
Anti-Static Value: 10^7-10^11 Omega;
Bubble: Yes or No;
Sample: Available and Are Free;
Sealing: Heat Seal;
Conductivity Value: 10^3-10^6 Omega;
Application: Electrical Components;
Feature: Antistatic, Moisture Proof;
Material: LLDPE/LDPE;
Shape: Plastic Bags;
Making Process: Composite Packaging Bag;
Raw Materials: Low Pressure Polyethylene Plastic Bag;
Bag Variety: Film Blowing;
Function: Anti Static, Moisture Barrier, Light Isolation;
Industrial Use: Electronic Components, Semiconductive Industry;
Color: Silver;
Surface Handling: Gravure Printing;
Bag Type: Open Top, Zip Lock, Three Dimensional, Gusset;
Application: Pricise Equipment, PC Board, IC, CD Driver;
Feature: Antistatic, Moisture Proof;
Material: Laminated Material;
Shape: Open Top, Ziplock, Three Dimensional, Gusset;
Making Process: Composite Packaging Bag;
Raw Materials: Pet/Al/Ny/PE BOPP/Al/PE;
Bag Variety: Open Top, Ziplock, Three Dimensional, Gusset;
Function: Anti Static, Moisture Barrier, Light Isolation;
Industrial Use: Electronic Components, Semiconductive Industry;
Color: Silver;
Surface Handling: Gravure Printing;
Bag Type: Open Top, Zip Lock, Three Dimensional, Gusset;
Application: Pricise Equipment, PC Board, IC, CD Driver;
Feature: Antistatic, Moisture Proof;
Material: Laminated Material;
Shape: Open Top, Ziplock, Three Dimensional, Gusset;
Making Process: Composite Packaging Bag;
Raw Materials: Pet/Al/Ny/PE BOPP/Al/PE;
Bag Variety: Open Top, Ziplock, Three Dimensional, Gusset;
Size: as Per Cutomer's Requiements;
Thickness: Available;
Printing: Machine Printing;
Color: Silver;
Application: Electronic Products, Promotion;
Feature: Shock Resistance, Recyclable, Moisture Proof;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Back Seal Bags;
Supplier Name

Shanghai Leenol Industrial Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Xunlan Technology Co., Ltd.

Diamond Member Audited Supplier

Suzhou Sky Industrial Co., Ltd.

Diamond Member Audited Supplier

Suzhou Sky Industrial Co., Ltd.

Diamond Member Audited Supplier

Suzhou Sky Industrial Co., Ltd.

Diamond Member Audited Supplier

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