| Specification |
Type: Package Material;
Usage: Combustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line;
Conductive: 1OE3-1OE5 Ohms;
Semi Conductive: 1OE6-E10e9 Ohms;
Dissipative: 1OE9-1OE11  Ohms;
Condition: New;
Waterproof: Waterproof;
Material: Plastic;
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Type: Bag;
Usage: Combustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line;
Standard Thickness: 0.14mm;
Bag Types: Open Top, Ziplock Top or Gusset Type;
Available Thicknesses: 0.1mm, 0.14mm or Others on Request;
Print Method: Copper Print Plate for Each Size;
Surface Resistance: 10e8 to 10e10 Ohms;
Feature: Antistatic, Electronic Static Discharge;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: Pet/Al/CPE or Pet/Al/Ny/CPE;
Bag Variety: Back Seal Bags;
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Function: Anti Static;
Industrial Use: Electronic Components, Semiconductive Industry;
Color: Semi-Transparent;
Surface Handling: Gravure Printing;
Bag Type: Open Top, Zip Lock;
Application: PC Board, IC, CD Driver, HD Pack;
Feature: Antistatic;
Material: Laminated Material;
Shape: Open Top, Zip Lock, Gusset Bag;
Making Process: Composite Packaging Bag;
Raw Materials: APET/PE APET/CPP;
Bag Variety: Open Top Bag, Zip Lock Bag;
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Type: Bag;
Usage: Combustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line;
Standard Thickness: 0.1mm / 0.14mm;
Bag Types: Open Top, Ziplock Top or Gusset Type;
Available Thicknesses: 0.1mm, 0.14mm or Others on Request;
Print Method: Copper Print Plate for Each Size;
Surface Resistance: 10e8 to 10e10 Ohms;
Feature: Antistatic, Electronic Static Discharge;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: Pet/Al/CPE or Pet/Al/Ny/CPE;
Bag Variety: Back Seal Bags;
|
Function: Anti Static;
Industrial Use: Electronic Components, Semiconductive Industry;
Color: Semi-Transparent;
Surface Handling: Gravure Printing;
Bag Type: Open Top, Zip Lock;
Application: PC Board, IC, CD Driver, HD Pack;
Feature: Antistatic;
Material: Laminated Material;
Shape: Open Top, Zip Lock, Gusset Bag;
Making Process: Composite Packaging Bag;
Raw Materials: APET/PE APET/CPP;
Bag Variety: Open Top Bag, Zip Lock Bag;
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