| Specification |
Type: Box, Package Material;
Usage: Electronic Component Maintenance Room, SMT Production Line;
Condition: New;
Waterproof: Waterproof;
Material: PVC/PP;
|
Function: Anti Static;
Industrial Use: Electronic Components, Semiconductive Industry;
Color: Semi-Transparent;
Surface Handling: Gravure Printing;
Bag Type: Open Top, Zip Lock;
Application: PC Board, IC, CD Driver, HD Pack;
Feature: Antistatic, Moisture Proof;
Material: Laminated Material;
Shape: Open Top, Zip Lock, Gusset Bag;
Making Process: Composite Packaging Bag;
Raw Materials: APET/PE APET/CPP;
Bag Variety: Open Top Bag, Zip Lock Bag;
|
Size: as Per Cutomer's Requiements;
Thickness: Available;
Printing: Machine Printing;
Color: Silver;
Application: Electronic Products, Promotion;
Feature: Shock Resistance, Recyclable, Moisture Proof;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Back Seal Bags;
|
Function: Anti Static, Moisture Barrier, Light Isolation;
Industrial Use: Electronic Components, Semiconductive Industry;
Color: Silver;
Surface Handling: Gravure Printing;
Bag Type: Open Top, Zip Lock, Three Dimensional, Gusset;
Application: Pricise Equipment, PC Board, IC, CD Driver;
Feature: Antistatic, Moisture Proof;
Material: Laminated Material;
Shape: Open Top, Ziplock, Three Dimensional, Gusset;
Making Process: Composite Packaging Bag;
Raw Materials: Pet/Al/Ny/PE BOPP/Al/PE;
Bag Variety: Open Top, Ziplock, Three Dimensional, Gusset;
|
Size: as Per Cutomer's Requiements;
Thickness: Available;
Printing: Machine Printing;
Color: Silver;
Application: Electronic Products, Promotion;
Feature: Shock Resistance, Recyclable, Moisture Proof;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Back Seal Bags;
|
