| Specification |
Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Cordierite;
Cell Shape: Square, Cell Shape Is Customizable;
Cell Number: 60X60 Cells, Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Aerospace, Electronics, Industrial Ceramic;
Color: White;
Compressive Strength: 2100-2500MPa;
Working Temperature: 1700 Degree;
Processing Service: Punching, Decoiling, Moulding;
Density: 3.8GM/Cc;
Feature: Heat Resistance;
Flexural Strength: 280-350 MPa;
Product Name: Alumina Ceramic Substrate;
Thermal Conductivity: 25-30 W/Mk;
Purity: 95%-99%;
Type: Ceramic Plates;
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Application: Aerospace, Ceramic Decorations, Medical, Amb Substrate;
Compressive Strength: 2300MPa;
Coating Thickness: 8-30μm;
Coating Layer: Mo/Mn;
Plated Layer: Nickel/Copper/Gold;
Thermal Conductivity: 25W/(M.K);
Plating Thickness: 2-9μm;
Max. Use Temperature: 1600℃;
Density: 3.7g/cm3;
Material Composition: Alumina, Al2O3;
Speciality: High Insulation, High Strength;
Type: Insulating Ceramics;
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Application: Electronic Devices, Power Supply, Semiconductors;
Material: AlN;
Process: Direct Bonded Copper;
Thickness: Customized;
Flexural Strength: 450MPa;
Surface Roughness: Ra 0.3-0.5;
Color: Grey;
Coefficient of Thermal Expansion: 4.8;
Thermal Conductivity: (25°C) 180 W/Mk;
Water Absorption: 0;
Processing Service: Moulding;
Density: 3.31g/cm3;
Melting Point: 2500;
Type: Plate;
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Application: Aerospace, Electronics, Medical, Vacuum Brazing;
Compressive Strength: 2300MPa;
Coating Thickness: 8-30μm;
Coating Layer: Mo/Mn;
Plated Layer: Nickel/Copper/Gold;
Thermal Conductivity: 25W/(M.K);
Plating Thickness: 2-9μm;
Max. Use Temperature: 1600℃;
Density: 3.7g/cm3;
Material Composition: Alumina, Al2O3;
Speciality: High Insulation, High Strength;
Type: Insulating Ceramics;
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