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Circuit PCB Boards Assembly Services
US$0.7078-1.42 / Piece
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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-499 Pieces US$1.42

500-1,999 Pieces US$1.07

2,000+ Pieces US$0.7078

Sepcifications

  • Metal Coating Tin
  • Mode of Production SMT
  • Base Material FR-4
  • Customized Customized
  • Condition New
  • Transport Package Standard Packaging or Customized
  • Specification Standard Specifications or Customized
  • Trademark KUNPENG
  • Origin Shenzhen, China
  • Product Name OEM PCBA Design
  • Keywords PCBA Design
  • Copper Thickness Customized
  • Supply Type OEM
  • Applications Communications, Automotive, Consumer Electronics
  • Type Custom PCBA
  • Operating System OEM
  • Memory OEM
  • PCB Testing Flying Probe PCB Testing
  • Surface Treatments HASL, Lf-HASL, Enig, Imm Tin, Imm AG, OSP

Product Description

Product Description PCBA DESIGN Transform your electronic designs with comprehensive PCB reverse engineering and PCBA manufacturing solutions that deliver exceptional quality and reliability. Our professional one-stop service covers everything from advanced circuit board analysis and precise cloning ...

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Circuit PCB Boards Assembly Services Comparison
Transaction Info
Price US$0.7078-1.42 / Piece US$2.51-5.00 / Piece US$0.76-5.00 / Piece US$0.76-5.00 / Piece US$1.68-5.82 / Piece
Min Order 1 Piece 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T T/T T/T
Quality Control
Product Certification - RoHS, ISO ISO RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification - ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
Trade Capacity
Export Markets Domestic Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model ODM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: SMT;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: OEM PCBA Design;
Keywords: PCBA Design;
Copper Thickness: Customized;
Supply Type: OEM;
Applications: Communications, Automotive, Consumer Electronics;
Type: Custom PCBA;
Operating System: OEM;
Memory: OEM;
PCB Testing: Flying Probe PCB Testing;
Surface Treatments: HASL, Lf-HASL, Enig, Imm Tin, Imm AG, OSP;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-6;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-6;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

Shenzhen Kunpeng Core Technology Co., Ltd

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

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