| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 Standard;
Thick Copper: 18um-140um(4oz);
Service: OEM/ODM, EMS;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Custom Design Product;
Board Material: Polyimide;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil, Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Type: Combining Rigid Circuit Board;
Mechanical Rigid: Rigid;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy, Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil, Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Type: Combining Rigid Circuit Board;
Mechanical Rigid: Rigid;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 2 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Custom Design Product;
Test: Fly Probe Testing;
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