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PCB
US$1.00-4.00 / Piece
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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$4.00

10-999 Pieces US$3.00

1,000-9,999 Pieces US$2.00

10,000+ Pieces US$1.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Complex
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand OEM
  • Transport Package Carton Box
  • Specification 200 PCS/CTN
  • Trademark Customer's brand
  • Origin China

Product Description

... Shenzhen Jingxin Electronic Technology Co.,Ltd. ... Built since 2002, is a almost 20 years professional company dedicating to PCB&PCBA industry. Our factory located in Shenzhen, and have dust-free workshop which cover an area of over than 10000m², almost 550 ...

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PCB Comparison
Transaction Info
Price US$1.00-4.00 / Piece US$0.90-99.99 / PCS US$0.90-99.99 / PCS US$0.90-99.99 / PCS US$0.90-99.99 / PCS
Min Order 1 Piece 1 PCS 1 PCS 1 PCS 1 PCS
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC
Quality Control
Management System Certification Others - - - -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Type: Rigid Circuit Board;
Dielectric: RO4534;
Material: Eramic-Filled, Glass-Reinforced Hydrocarbon;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Surface Finish: Immersion Silver;
Board Thickness: 0.8mm (Finished);
Layer Count: 2-Layer;
Solder Mask: No;
Type: Rigid Circuit Board;
Dielectric: F4btms350;
Material: Glass Fiber Cloth, Nano-Ceramics, and PTFE Resin;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Wangling;
Blind Vias: None;
Board Thickness: 6.42mm;
Layer Count: 2-Layer;
Finished Cu Weight: 1oz;
Type: Rigid Circuit Board;
Dielectric: F4btme300;
Material: PTFE Resin with Nano-Ceramic Fillers;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Wangling;
Blind Vias: None;
Board Thickness: 3.1mm;
Layer Count: 2-Layer;
Finished Cu Weight: 1oz;
Type: Rigid Circuit Board;
Dielectric: 5880lz;
Material: Filled PTFE Composite;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Surface Finish: OSP;
Board Thickness: 0.6mm (Finished);
Layer Count: 2-Layer;
Solder Mask: None;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

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