| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Min. Hold Size: 0.2mm;
Min. Line Width: 0.075mm;
Surface Finishing: Immersion Gold, OSP, HASL Lf;
Soldermask Color: Green, Blue, Red, White, Yellow;
Certificates: RoHS, ISO, Ts, UL;
Board Thinckness: 0.2-5.0mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Abis;
Supplier: Kb, Shenyi, Rogers, Iteq;
Ink: Red, Yellow, Blue, Green, etc.;
Application: Consumer Electronics;
Surface Finish: Enig, Hal, Lf-HASL, OSP, Tin, etc...;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Kb, Shenyi, Rogers, Iteq;
Thickness: 1.6mm;
Structure: Multilayer FPC;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: PP;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Kb, Shenyi, Rogers, Iteq;
Shenzhen: China;
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