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Multilayer Assembly
US$0.05-16.00 / Piece
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Custom PCB and PCBA Manufacturing for Supply Power

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$16.00

10-99 Pieces US$9.00

100-999 Pieces US$0.90

1,000+ Pieces US$0.05

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Complex
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Model PCB
  • Brand Customer's Brand
  • Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
  • Specification 49 x 42 x 36 Centimeters/Piece
  • Trademark JXpcba
  • Origin China

Product Description

Jingxin PCBA Electronic Technology Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicating to PCB and PCBA manufacturing for 20 years, providing professional OEM electronic manufacturing services for customers in various fields around the world. Since its ...

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Multilayer Assembly Comparison
Transaction Info
Price US$0.05-16.00 / Piece US$0.90-99.99 / PCS US$1.53-1.81 / Piece US$2.51-2.79 / Piece US$0.90-99.99 / PCS
Min Order 1 Piece 1 PCS 200 Pieces 200 Pieces 1 PCS
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram Small-amount payment, Western Union, PayPal, D/P, T/T, LC T/T, PayPal T/T, PayPal Small-amount payment, Western Union, PayPal, D/P, T/T, LC
Quality Control
Management System Certification Others - ISO9001:2015 ISO9001:2015 -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia Domestic Domestic North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Type: Rigid Circuit Board;
Dielectric: Rt/Duroid 6035HTC;
Material: Ceramic-Filled PTFE Composite;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Surface Finish: Immersion Silver;
Board Thickness: 0.3mm (Finished);
Layer Count: 2-Layer;
Solder Mask: Green(Top Only);
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: RS7227-96;
Brand: Raysilicon;
Powersupply: 2.7-5.5V;
Currentconsumption: 16mA;
Maximumspeed: 2000rpm;
Incrementaloutputs: a B;
Operatingandstorage: -40°c~85°c;
Radialtolerance: ±0.3mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Raysilicon;
Powersupply: 2.7-5.5V;
Currentconsumption: 16mA;
Maximumspeed: 2000rpm;
Incrementaloutputs: a B;
Operatingandstorage: -40°c~85°c;
Radialtolerance: ±0.3mm;
Type: Rigid Circuit Board;
Dielectric: F4btms1000;
Material: Ceramic-Filled PTFE Composite;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Wangling;
Surface Finish: Bare Copper;
Board Thickness: 6.4mm (Finished);
Layer Count: 2-Layer;
Solder Mask: None;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Jiangsu Raysilicon Technologies Co. Ltd

Gold Member Audited Supplier

Jiangsu Raysilicon Technologies Co. Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

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