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Mobile Phone PCB
US$0.01-37.00 / Piece
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Premium Mobile Phone PCBA&PCB Gerber Files for SMT Assembly

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$37.00

10-99 Pieces US$25.00

100-999 Pieces US$16.00

1,000+ Pieces US$0.01

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric CEM-3
  • Material Complex
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Model PCB
  • Brand Customer's Brand
  • Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
  • Specification 49 x 42 x 36 Centimeters/Piece
  • Trademark JXpcba
  • Origin China
  • Test Ict/Fct
  • Certification ISO 9001/14001
  • Inner Packing Vacuum
  • Outer Packing Carton

Product Description

About us Jingxin PCBA Electronic Technology Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicating to PCB and PCBA manufacturing for 20 years, providing professional OEM electronic manufacturing services for customers in various fields around the world. Since ...

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Mobile Phone PCB Comparison
Transaction Info
Price US$0.01-37.00 / Piece US$0.01-150.00 / Piece US$0.10-150.00 / Piece US$0.10-150.00 / Piece US$0.90-99.99 / PCS
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 PCS
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union Small-amount payment, Western Union, PayPal, D/P, T/T, LC
Quality Control
Product Certification ISO 9001/14001 - - - -
Management System Certification Others - - - -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - - ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Test: Ict/Fct;
Inner Packing: Vacuum;
Outer Packing: Carton;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: N/a;
Board Thickness: 1.6 mm;
Surface: Immersion Gold;
Solder Mask: Green;
Silk: White;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Kb;
Cooper Thickness: 1oz;
Surface Finishing: Hal Lead Free;
Solder Mask Color: Green;
Silkscreen: White;
Min Line Width/Space: 0.2mm/0.2mm;
Min Hole Diameter: 0.2mm;
Finished Board Thickness: 1.6 mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Cooper Thickness: 1oz;
Surface Finishing: Hal Lead Free;
Solder Mask Color: Green;
Silkscreen: White;
Min Line Width/Space: 0.2mm/0.2mm;
Min Hole Diameter: 0.2mm;
Finished Board Thickness: 1.6 mm;
Type: Rigid Circuit Board;
Dielectric: Hydrocarbon / Ceramic / Woven Glass;
Material: Hydrocarbon / Ceramic / Woven Glass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Hydrocarbon / Ceramic / Woven Glass;
Insulation Materials: Hydrocarbon / Ceramic / Woven Glass;
Model: PCB;
Brand: Rogers;
Final Foil External: 1.5 Oz;
Board Thickness: 1.6 mm ±0.16mm;
Surface Finish: Immersion Gold;
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Spac: 14 Mil / 14 Mil;
Minimum / Maximum Holes: 0.4 mm / 4.0 mm;
Via: Minimum Size 0.4mm.;
Test: 100% Electrical Test Prior Shipment;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

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