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PCB Design Module Power Bank Wireless off Grid Solar Inverter ODM Amplifier Circuit Board PCBA Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$1.34

100-999 Pieces US$0.85

1,000+ Pieces US$0.25

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Aluminum Covered Copper Foil Layer
  • Application Consumer Electronics
  • Flame Retardant Properties V1
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Brand Jxpcba
  • Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
  • Specification Custom HDI PCBA
  • Trademark JXpcba
  • Origin China
  • Product Type Custom HDI PCBA
  • Service One-Stop Turnkey
  • Applicational Electronics Device/Home Appliances
  • Testing Service Aoi X-ray Function Test
  • Raw Material Fr4/Cem-1/Cem-3/Fr1/Aluminum
  • Board Thickness 0.2mm-7.0mm
  • Layer 1-32 Layers
  • Solder Mask Color Blue.Green.Red.Black.White.etc
  • Surface Finishing HASL\OSP\Immersion Gold
  • Certificate ISO9001/IATF16949/CE/RoHS
  • PCBA Packaging Bubble Bag, ESD Bag, Anti-Shock Bag
  • Standard Ipc-160-2
  • Copper Thickness 18um-210um(6oz)
  • MOQ 1 PCS
  • Other Service PCB Clone, Reverse Engineering, IC Cracking

Product Description

PRODUCTS DESCRIPTION SPECIFICATION Term Detailed Specification of PCBA Board Manufacturing Layer 1-30 layer Material FR-4, CEM-1, CEM-3, Hight TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Board thickness 0.4mm-4mm Max.finished board side 1020mm*1000mm Min.drilled hole size 0.25mm ...

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PCB Comparison
Transaction Info
Price US$0.25-1.34 / Piece US$0.10-1.00 / Piece US$0.10-1.00 / Piece US$0.50-1.00 / Piece US$0.50-1.00 / Piece
Min Order 10 Pieces 1 Piece 1 Piece 10 Pieces 10 Pieces
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification ISO9001/IATF16949/CE/RoHS ISO9001,ISO14001,ISO13485,Ts-16949,etc ISO9001,ISO14001,ISO13485,Ts-16949,etc - -
Management System Certification Others ISO14001, Others ISO14001, Others - -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America North America
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jxpcba;
Product Type: Custom HDI PCBA;
Service: One-Stop Turnkey;
Applicational: Electronics Device/Home Appliances;
Testing Service: Aoi X-ray Function Test;
Raw Material: Fr4/Cem-1/Cem-3/Fr1/Aluminum;
Board Thickness: 0.2mm-7.0mm;
Layer: 1-32 Layers;
Solder Mask Color: Blue.Green.Red.Black.White.etc;
Surface Finishing: HASL\OSP\Immersion Gold;
PCBA Packaging: Bubble Bag, ESD Bag, Anti-Shock Bag;
Standard: Ipc-160-2;
Copper Thickness: 18um-210um(6oz);
MOQ: 1 PCS;
Other Service: PCB Clone, Reverse Engineering, IC Cracking;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Mustar;
D/C: Standard;
Condition: New Original;
Warranty: 2 Years;
Mountng Type: SMT ,DIP;
Memory Type: Standard;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Mustar;
D/C: Standard;
Condition: New Original;
Warranty: 2 Years;
Mountng Type: SMT ,DIP;
Memory Type: Standard;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

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