| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Test: Aoi/Spi/X-ray;
Packing: Carton/Vacuum/Plastic;
Delivery: 7-15 Days Sample;
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Type: Rigid Circuit Board;
Dielectric: RO4350b Lopro;
Material: Hydrocarbon Ceramic Laminates;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: RO4350b Lopro;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 60.7mil;
Layer Count: Double Layer;
Application: Antennas;
Surface Finish: Immersion Gold;
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Type: Rigid Circuit Board;
Dielectric: CEM-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Rogers;
Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
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Type: Rigid Circuit Board;
Dielectric: RO3203;
Material: Ceramic-Filled Laminates,Woven Fiberglass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Bare Copper, HASL, Enig, Immersoin Silver,etc.;
Base Material: RO3203;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 30mil;
Layer Count: 2-Layer;
Dk: 3.02;
Copper Weight: 0.5, 1 or 2 Oz;
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Type: Rigid Circuit Board;
Dielectric: Rt/Duroid 6035HTC;
Material: Ceramic-Filled PTFE Composites;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Rt/Duroid 6035HTC;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 60mil;
Layer Count: 2-Layer;
Application: RF and Microwave;
Surface Finish: Immersion Gold;
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