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Network Communication Board
US$1.00-4.00 / Piece
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What is High-Quality OSP PCB&PCBA for Reliable Network Communication Solutions

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$4.00

10-999 Pieces US$3.00

1,000-9,999 Pieces US$2.00

10,000+ Pieces US$1.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Complex
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Model FR-4
  • Brand OEM
  • Transport Package Carton Box
  • Specification 200 PCS/CTN
  • Trademark Customer's brand
  • Origin China
  • Test Aoi/Spi
  • Certification ISO 9001/14001
  • Inner Packing Vacuum
  • Outer Packing Carrton

Product Description

About us Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicating to PCB and PCBA manufacturing for 20 years, providing professional IEM electronic manufacturing services for customers in various fields around the world. Since its establishment in 2002, the ...

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Network Communication Board Comparison
Transaction Info
Price US$1.00-4.00 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.10-5.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, Western Union T/T, Western Union T/T, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification ISO 9001/14001 - - - -
Management System Certification Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM Own Brand, ODM Own Brand, ODM Own Brand, ODM -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
Test: Aoi/Spi;
Inner Packing: Vacuum;
Outer Packing: Carrton;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: PCB;
Brand: Hongyu;
Board Thickness: 0.8mm;
Metal Core PCB: T2 High Conductivity Copper(0.8mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 35/35μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: PCB;
Brand: Hongyu;
Board Thickness: 0.8mm;
Metal Core PCB: T2 High Conductivity Copper(0.8mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 35/35μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: PCB;
Brand: Hongyu;
Board Thickness: 0.8mm;
Metal Core PCB: T2 High Conductivity Copper(0.8mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 35/35μm;
Tg: 150°C;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Synthetic Fiber;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green / Black / Blue / Red / Yellow;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 0.5mm / 0.8mm / 1.6mm Custom;
Custom: OEM / ODM;
Copper: 0.5oz / 18um, 2oz / 70um;
Layers: 2 -4 Layers, Custom;
Legend: White;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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