| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Copper;
Application: Communication;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
PCBA Material: FR4, High TG, Halogen-Free, High Frequency;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Number of Layer: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
PCB Silkscreen Color: Black, White, Yellow;
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Structure: Fr4;
Dielectric: FR-4;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Fr4;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB: Custom Design Product;
Layers: 1-26 Layers;
Dielectric Thickness: 3mil-8mil;
Laser Size: 4mil(0.1mm);
Max.Panel Dimension: 39000mi*47000mil;
Test: Aoi;
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Structure: Fr4;
Dielectric: FR-4;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Fr4;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB: Custom Design Product;
Layers: 1-26 Layers;
Dielectric Thickness: 3mil-8mil;
Laser Size: 4mil(0.1mm);
Max.Panel Dimension: 39000mi*47000mil;
Test: Aoi;
|
Structure: Fr4;
Dielectric: FR-4;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Fr4;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB: Custom Design Product;
Layers: 1-26 Layers;
Dielectric Thickness: 3mil-8mil;
Laser Size: 4mil(0.1mm);
Max.Panel Dimension: 39000mi*47000mil;
Test: Aoi;
|
Structure: Fr4;
Dielectric: FR-4;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Board Material: Fr4;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB: Custom Design Product;
Layers: 1-26 Layers;
Dielectric Thickness: 3mil-8mil;
Laser Size: 4mil(0.1mm);
Max.Panel Dimension: 39000mi*47000mil;
Test: Aoi;
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