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PCBA Manufacturing
US$2.18 / Piece
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What is PCB Assembly Printed Circuit Board PCBA Manufacturing in Shenzhen for Medical

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 Pieces US$2.18 / Piece

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Paper Laminate
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Additive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Jxpcba
  • Transport Package Air Bubble Film, Vacuum Package, ESD Bag+Carton
  • Specification custom
  • Trademark JXpcba
  • Origin China
  • MOQ at Least 1piece
  • Delivery Term Fob Shenzhen
  • Payment Term by T/T in Advance
  • Leadtime 15days After Receipt of Your Full Payment
  • Component Packing Tary, Tube, Tape
  • Number of Floors 1-32
  • Minimum Line Width/Spacing 3.0mil
  • Maximum Plate Thickness Aperture Ratio 30:1
  • Minimum Mechanical Drilling Aperture 6mil
  • Board Thickness 0.2mm~6.0mm
  • Maximum Board Size 640mm*1100mm
  • PCBA Test Static Test, Power-on Function Test, Power-on Agin
  • PCBA Packaging Static Packaging, Shockproof Packaging, Anti-Drop

Product Description

Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Teflon, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate: RoHS Directive-Compliant PCB Thickness: 1.6 ±0.1mm Out Layer Copper Thickness: ...

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PCBA Manufacturing Comparison
Transaction Info
Price US$2.18 / Piece US$20.00 / Piece US$0.99 / PCS US$0.99 / PCS US$0.99 / PCS
Min Order 10 Pieces 1,000 Pieces 1 PCS 1 PCS 1 PCS
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC
Quality Control
Management System Certification Others - - - -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
MOQ: at Least 1piece;
Delivery Term: Fob Shenzhen;
Payment Term: by T/T in Advance;
Leadtime: 15days After Receipt of Your Full Payment;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Structure: Metal Base Rigid PCB;
Dielectric: Al;
Material: Al;
Application: PCB;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Hfi;
Structure: Double-Sided Rigid PCB;
Dielectric: RF-60A;
Material: Organic-Ceramic Woven Glass Reinforced Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Pure Gold Plating;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Copper Weight: 1oz;
Soldermask Color: No;
Silkscreen: No;
Layer Count: 2-Layer;
Structure: Double-Sided Rigid PCB;
Dielectric: Tmm10I;
Material: Ceramic Thermoset Polymer Composite;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Pure Gold Plating;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Copper Weight: 1oz;
Soldermask Color: No;
Silkscreen: No;
Layer Count: 2-Layer;
Structure: Double-Sided Rigid PCB;
Dielectric: Ad300d;
Material: Ceramic-Filled, Glass-Reinforced PTFE-Based;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Epig (Nickel-Free);
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Copper Weight: 1oz;
Soldermask Color: No;
Silkscreen: No;
Layer Count: 2-Layer;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Hainan Fuwang Industrial Co., Ltd.

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

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