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PCB
US$0.18-2.34 / Piece
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What is PCB Assembly 94V0 Multilayer HDI PCB Board Bom SMT PCBA for Ai

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$2.34

100-999 Pieces US$1.85

1,000-9,999 Pieces US$1.20

10,000+ Pieces US$0.18

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Aluminum Covered Copper Foil Layer
  • Application Consumer Electronics
  • Flame Retardant Properties V1
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Brand Jxpcba
  • Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
  • Specification Custom HDI PCBA
  • Trademark JXpcba
  • Origin China
  • Product Type Custom HDI PCBA
  • Service One-Stop Turnkey
  • Applicational Electronics Device/Home Appliances
  • Testing Service Aoi X-ray Function Test
  • Raw Material Fr4/Cem-1/Cem-3/Fr1/Aluminum
  • Board Thickness 0.2mm-7.0mm
  • Layer 1-32 Layers
  • Solder Mask Color Blue.Green.Red.Black.White.etc
  • Surface Finishing HASL\OSP\Immersion Gold
  • Certificate ISO9001/ISO14001/CE/RoHS
  • PCB Solder Mask White, Black, Yellow, Green, Red, Blue
  • Component Packing Tary, Tube, Tape
  • Maximum Board Size 640mm*1100mm
  • PCBA Test Static Test, Power-on Function Test, Power-on Agin
  • PCBA Packaging Static Packaging, Shockproof Packaging, Anti-Drop

Product Description

Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Teflon, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate: RoHS Directive-Compliant PCB Thickness: 1.6 ±0.1mm Out Layer Copper Thickness: ...

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PCB Comparison
Transaction Info
Price US$0.18-2.34 / Piece US$35.00 / Piece US$35.00 / Piece US$35.00 / Piece US$35.00 / Piece
Min Order 10 Pieces 500 Pieces 500 Pieces 500 Pieces 500 Pieces
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification ISO9001/ISO14001/CE/RoHS - - - -
Management System Certification Others - - - -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jxpcba;
Product Type: Custom HDI PCBA;
Service: One-Stop Turnkey;
Applicational: Electronics Device/Home Appliances;
Testing Service: Aoi X-ray Function Test;
Raw Material: Fr4/Cem-1/Cem-3/Fr1/Aluminum;
Board Thickness: 0.2mm-7.0mm;
Layer: 1-32 Layers;
Solder Mask Color: Blue.Green.Red.Black.White.etc;
Surface Finishing: HASL\OSP\Immersion Gold;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Maximum Board Size: 640mm*1100mm;
PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

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