| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flexible PCB;
PCB Material: Fr-4, Cem-1, Cem-3, Aluminum, FPC, Rogers, Isola 3;
Layer: 1- 32 Layers;
Board Thickness: 0.3mm-4mm;
Surface Finish: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
Copper Thickness: 18um-210um(6oz);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow, etc;
PCB Standard: Ipc-a-610, Ipc-a-620;
Certificates: ISO9001, ISO14001, IATF 16949, ISO 13485;
Profiling Punching: Routing, V-Cut, Beveling;
OEM Services: PCBA, PCBA Aassembly: SMT & Pth & BGA;
ODM Services: PCB Design, PCB Layout, PCB Clone;
EMS Services: PCB Prototype, PCB Reverse Engineering;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Tes;
Other Services: Chip Programming & Function Test, Gluing, Conforma;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Solder Mask: Green;
Legend: White;
Forming: Scored;
Board Thickness: 1.6mm;
Copper Thickness: 35um;
Surface Finish: Enig;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Kb,Shenyi,Rogers,Iteq;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Board Thickness: 0.15/0.8/1.0/1.6/2.0/2.4/2.8/3.0/3.2mm;
Inner Copper: 1/2/3/4 Oz;
Finish Copper: 1/2/3/4 Oz;
Surface Finish: Enig/HASL/HASL Lf/OSP;
Solder Mask: Green/White/Red/Orange/Purple;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.6mm;
Copper Thickness: 35um/1oz;
Surface Finish: Immersion Gold/Customized;
Solder Mask: Matt Green/Customized;
Legend: White/Customized;
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Type: Rigid Circuit Board;
Dielectric: Copper Base+Fr4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Kb, Shenyi, Rogers, Iteq;
Layer: 1-20 Layers;
Raw Material: Fr-4, Cu Base, High Tg Fr-4, PTFE, Rogers, Teflon etc;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Minimum Space/Line: 0.075mm;
Surface Finish/Treatment: HASL, Enig, Chem, Tin, Flash Gold, OSP, Gold Finger;
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