| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Jingxin;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
Insulation Resin: Epoxy Resin;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min. Line Width: 0.15mm;
Hole Spacing: 2.54mm;
Board Thickness: 0.2-4.0mm;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Modelnumber: PCB;
Number of Layers: 1-24layer;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finishing: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Copper Thickness: 1oz or Custom;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Board Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
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Type: Rigid Circuit Board;
Dielectric: RO3003G2 (Ceramic-Filled PTFE);
Material: Ceramic-Filled PTFE;
Application: Traffic Jam Pilot;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: RO3003G2 Dielectric Material;
Insulation Materials: Ceramic-Filled PTFE;
Brand: Rogers;
Surface Finish: Immersion Gold, HASL, Immersion Silver, Immersion;
Layer Count: Single Sided, Double Sided, Multi-Layer PCB, Hybri;
Solder Mask: Green, Black, Blue, Yellow, Red, Purple etc.;
Dissipation Factor: 0.0011;
PCB Material: Ceramic-Filled PTFE Laminates;
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Type: Rigid Circuit Board;
Dielectric: Organic Polymer Ceramic Fiberglass;
Material: a Blend of Hydrocarbon Resin, Ceramics, and Fiberg;
Application: Power Amplifiers;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: a Blend of Hydrocarbon Resin, Ceramics, and Fiberg;
Insulation Materials: Hydrocarbon-Ceramic Composite Dielectric (Fibergla;
Brand: Wangling;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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