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Multilayer PCB Board
US$5.00-8.00 / Piece
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High-Quality Multilayer PCB Board for Electronics Assembly and Prototyping

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$8.00

10-99 Pieces US$7.00

100-999 Pieces US$6.00

1,000+ Pieces US$5.00

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric CEM-3
  • Material Complex
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Model PCB
  • Brand Customer's Brand
  • Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
  • Specification 49 x 42 x 36 Centimeters/Piece
  • Trademark JXpcba
  • Origin China
  • Certification ISO 9001/ ISO 14001/ RoHS
  • Test Aoi Test/ Spi Test/ X-ray Test
  • PCB Shape Any Shape
  • Applicational Electronics Device

Product Description

Company Profile Jingxin PCBA Electronic Technology Co.ltd Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicating to PCB and PCBA manufacturing for 20 years, providing professional OEM electronic manufacturing services for customers in various fields ...

Learn More

Multilayer PCB Board Comparison
Transaction Info
Price US$5.00-8.00 / Piece US$2.40 / Piece US$2.40 / Piece US$45.00-100.00 / Piece US$0.10 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification ISO 9001/ ISO 14001/ RoHS UL, RoHS, SGS, ISO9001 - - -
Management System Certification Others - - - -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Test: Aoi Test/ Spi Test/ X-ray Test;
PCB Shape: Any Shape;
Applicational: Electronics Device;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Surface Finishing: Hf-HASL;
Copper Thickness: 35um;
Board Thickness: 1.2mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.25mm;
Min. Line Spacing: 0.25mm;
Shipping: DHL, UPS, TNT, FedEx, etc;
MOQ: 1PCS;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Copper Thickness: 1oz;
Surface Treatment: Enig;
Soldermask: Green;
Silkscreen: White;
Shipping: DHL, UPS, TNT, FedEx, etc;
Certificates: UL, RoHS, SGS, ISO9001;
Min Line Width: 0.15mm;
Min Hole Size: 0.2mm;
Min Line Space: 0.15mm;
MOQ: 1PCS;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Surface Finishing: Immersion Gold;
Solder Mask Type: Green;
Silkscreen: White;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Min Line Width: 0.15mm;
Min Hole Size: 0.2mm;
Min Line Space: 0.15mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Copper Thickness: 1oz;
Layer: 1L;
Board Thickness: 1.6mm;
Surface Finished: Immersion Gold;
Min.Hole Size: 0.2mm;
Min. Line Width: 0.12mm;
Min. Line Space: 0.12mm;
Test: E-Test;
Package: Vacuum Package;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

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