| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Industry: Medical;
Test: Aoi/ Spi;
Outer Packing: Standard Carton Packing;
PCB Shape: Any Shape;
PCB Thickness: 0.3-1.6mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Unice;
Layer: 1 to 20;
Mini Board Size: 8*8mm;
Max Board Size: 650*610mm;
Board Thickness: 0.3mm~3.5mm;
Finished Inner Copper Thickness: H/H0z-4/40z;
Finished Outer Copper Thickness: H/H0z-5/50z;
Min Hole Size: 0.2mm;
Surface Finishing: OSP, Immersion Gold, Gold Plating, Enig, Enepig;
Warranty: 1 Year;
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Type: Rigid Circuit Board;
Dielectric: Aluminum;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: UC;
Layers: 2;
Thickness: 1.6mm;
Cooper Thickness: 35/35um;
Solder Mask Color: White;
Surface Treatment: HASL Lead Free;
Ipc Standards: Ipc Class II;
PCB Testing: E-Testing, Flying Probe Testing;
Lead Time: 5-15 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Unice;
Layer: 1 to 20;
Mini Board Size: 8*8mm;
Max Board Size: 650*610mm;
Board Thickness: 0.3mm~3.5mm;
Finished Inner Copper Thickness: H/H0z-4/40z;
Finished Outer Copper Thickness: H/H0z-5/50z;
Min Hole Size: 0.2mm;
Surface Finishing: OSP,Immersion Gold,Gold Plating,Enig,Enepig;
Warranty: 1 Year;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Okey;
Service: Turnkey Assembly PCB Service;
Shape: Rectangular, Round, Slots, Cutouts, Complex, Irregula;
Board Thickness: 0.4-5.0mm;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion Tin;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum, Copper Base, Teflon;
Order Qty: Not Limited;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Customized: Customizable;
Min. SMD Size: 01005;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
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