| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
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Type: Rigid Circuit Board;
Dielectric: CEM-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Rogers;
Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Abis;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
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Type: Rigid Circuit Board;
Dielectric: RO4350b Lopro;
Material: Hydrocarbon Ceramic Laminates;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: RO4350b Lopro;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 20.7mil;
Layer Count: Double Layer;
Application: Low Noise Amplifier;
Surface Finish: Immersion Gold;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Woven Fiberglass Reinforced, Ceramic Filled, PTFE;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Thickness: 20 Mil;
Layer Count: Double Layer, Multilayer, Hybrid PCB;
Application: Higher Amplifier;
Surface Finish: Bare Copper, HASL, Enig, OSP, Immersion Tin etc..;
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