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PCB Assembly
US$0.50-6.00 / Piece
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What is PCB Assembly Manufacturer for Home Appliance PCBA Layout Design in Shenzhen

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-98 Pieces US$6.00

99-998 Pieces US$4.00

999-9,998 Pieces US$3.00

9,999+ Pieces US$0.50

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Computer
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Semi-Additive Process
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Brand Jingxin
  • Transport Package Carton Box
  • Specification 200pcs/CTN
  • Trademark Customer&prime' s brand
  • Origin China

Product Description

Product Description OEM manufacturer electronic PCBA circuit board for refrigerator Shenzhen factory Our SMT PCB PCBA manufacture: 1. No MOQ for Printed circuit board and SMT DIP pcb assembling. 2. One-stop solution for SMT DIP PCB assembly. 3. Professional PCB engineer for one-to-one ...

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PCB Assembly Comparison
Transaction Info
Price US$0.50-6.00 / Piece US$0.01-100.00 / Piece US$0.10-100.00 / Piece US$0.10-100.00 / Piece US$0.10-20.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification - - UL,ISO9001&ISO14001,SGS,RoHS Report UL,ISO9001&ISO14001,SGS,RoHS Report -
Management System Certification Others - - - -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Color: Black, Green, White, Red, Blue;
Max Copper: 6oz;
Max Thickness: 6mm;
Layer: 1-20 Layers;
Minimum Line/ Space: 0.075mm;
Structure: Single-Sided Rigid PCB;
Dielectric: Copper;
Material: Copper Base;
Application: LED;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Thermal Conductivity: 1-3W/M.K;
Thermoelectric Separation: up to 400W/M.K;
Structure: Single-Sided Rigid PCB;
Dielectric: Copper;
Material: Copper Base;
Application: LED, Car Light;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Thermal Conductivity: 1-3W/M.K;
Thermoelectric Separation: up to 400W/M.K;
Board Thickness: 0.3-5mm;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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