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Custom PCB Assembly
US$2.00 / Piece
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China Reliable PCB Assembly Fr4 Copper Manufacturing

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$2.00 / Piece

Sepcifications

  • Metal Coating Copper
  • Mode of Production SMT
  • Layers Double-Layer
  • Base Material FR-4
  • Certification RoHS
  • Customized Customized
  • Condition New
  • Transport Package Carton
  • Specification 20g
  • Trademark jinxin
  • Origin Shenzhen
  • PCB QA E-Test, Aoi, X-ray, Function Test
  • Sample Date 5-7days
  • Shipment Air, Sea, Express(DHL TNT FedEx EMS UPS
  • Surface Treatment Gold Finger/Hard Gold
  • SMT Machine Siemens Siplace D1/D2 / Siemens Siplace S20/F4
  • Board Thickness 0.2-6mm
  • Copper Thickness 0.5-12oz(18-420um)
  • Solder Mask Color Green/Black/White/Red/Blue/Yellow
  • Hole Diameter Min0.05mm
  • Min. Line Width 0.10mm(4mil)
  • Min. Line Spacing 0.10mm(4mil)
  • Test 100% E-Test
  • One Stop Service PCB Assembly, Component Sourcing, Box Building
  • Max. Finished Board Side 1020mm*1000mm
  • MOQ No

Product Description

... Shenzhen Jingxin Electronic Technology Co.,Ltd. ... Built since 2002, is a almost 20 years professional company dedicating to PCB&PCBA industry. Our factory located in Shenzhen, and have dust-free workshop which cover an area of over than 10000m2, almost 550 employees, more than 30 production ...

Learn More

Custom PCB Assembly Comparison
Transaction Info
Price US$2.00 / Piece US$0.98-5.00 / Piece US$0.89-6.00 / Piece US$20.00 / Piece US$0.89-5.00 / Piece
Min Order 1 Piece 10 Pieces 10 Pieces 100 Pieces 10 Pieces
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T T/T T/T T/T
Quality Control
Product Certification RoHS RoHS, CCC, ISO ISO RoHS, ISO, ISO13485,IATF16949 RoHS, CCC, ISO
Management System Certification Others ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCB QA: E-Test, Aoi, X-ray, Function Test;
Sample Date: 5-7days;
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS;
Surface Treatment: Gold Finger/Hard Gold;
SMT Machine: Siemens Siplace D1/D2 / Siemens Siplace S20/F4;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-12oz(18-420um);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Hole Diameter: Min0.05mm;
Min. Line Width: 0.10mm(4mil);
Min. Line Spacing: 0.10mm(4mil);
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Max. Finished Board Side: 1020mm*1000mm;
MOQ: No;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-6;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Tin;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

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