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PCB Circuit Motherboard
US$0.68-1.68 / Piece
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What is Motherboard PCB Circuit SMT and DIP Technology Electronics PCBA with Component

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$1.68

100-999 Pieces US$1.48

1,000-1,999 Pieces US$1.08

2,000+ Pieces US$0.68

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Paper Laminate
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Additive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Jxpcba
  • Transport Package Air Bubble Film, Vacuum Package, ESD Bag+Carton
  • Specification custom
  • Trademark JXpcba
  • Origin China
  • PCBA Material Fr4, High Tg, Halogen-Free, High Frequency
  • Surface Treatment HASL/Immersion Gold/Immersion Silver/Immersion Tin
  • Certificate ISO9001/ISO14001/CE/RoHS
  • PCB Solder Mask White, Black, Yellow, Green, Red, Blue
  • Component Packing Tary, Tube, Tape
  • Number of Floors 1-32
  • Minimum Line Width/Spacing 3.0mil
  • Maximum Plate Thickness Aperture Ratio 30:1
  • Minimum Mechanical Drilling Aperture 6mil
  • Board Thickness 0.2mm~6.0mm
  • Maximum Board Size 640mm*1100mm
  • PCBA Test Static Test, Power-on Function Test, Power-on Agin
  • PCBA Packaging Static Packaging, Shockproof Packaging, Anti-Drop
  • PCBA Testing Service Aoi, Ict, X-ray, Flying Probe Test
  • Product Application Consumer Electronics/Home Appliances/Medical Equip

Product Description

Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Teflon, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate: RoHS Directive-Compliant PCB Thickness: 1.6 ±0.1mm Out Layer Copper Thickness: ...

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PCB Circuit Motherboard Comparison
Transaction Info
Price US$0.68-1.68 / Piece US$0.10 / Piece US$0.10 / Piece US$0.01-20.00 / Piece US$0.40-1.00 / Square Meter
Min Order 10 Pieces 1 Piece 1 Piece 1 Piece 1 Square Meter
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification ISO9001/ISO14001/CE/RoHS RoHS, UL, SGS, Ect RoHS, UL, SGS, Ect - UL, SGS, RoHS, ISO 9001, Ect
Management System Certification Others - - - -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
PCBA Material: Fr4, High Tg, Halogen-Free, High Frequency;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finishing: OSP;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Wigth: 0.15mm;
Min. Line Spacing: 0.15mm;
Color: White;
Size: 66*56mm;
Package: Vacuum;
Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finishing: OSP;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Wigth: 0.15mm;
Min. Line Spacing: 0.15mm;
Color: White;
Size: 66*56mm;
Package: Vacuum;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Aerospace;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Copper Thickness: 1oz;
Green Solder Mask: Green;
Surface Finish: HASL-Lead Free;
Board Thickness: 1mm;
Min Hole Size: 0.6mm;
Min Line Width: 4mil;
Min Line Spacing: 4mil;
Surface Finishing: Hal, Immersion Gold, Ect;
Package: Vacuum;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Xinjiaye Electronics Technology Co., Ltd.

Diamond Member Audited Supplier

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