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US$1.00-4.00 / Piece
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ODM Bluetooth Device PCB & PCBA Printed Circuit Board Assembly

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$4.00

10-999 Pieces US$3.00

1,000-9,999 Pieces US$2.00

10,000+ Pieces US$1.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Complex
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Model FR-4
  • Brand OEM
  • Transport Package Carton Box
  • Specification 200 PCS/CTN
  • Trademark Customer's brand
  • Origin China
  • Test Aoi/Spi/X-ray
  • Certification ISO/RoHS/UL/IATF
  • Delivery 7-15 Days Sample
  • Packing Carton/Custom

Product Description

Company Profile Shenzhen Jingxin Electronic Technology Co., Ltd. Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicating to PCB and PCBA manufacturing for 20 years, providing professional IEM electronic manufacturing services for customers in various fields ...

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Transaction Info
Price US$1.00-4.00 / Piece US$0.90-99.99 / PCS US$0.90-99.99 / PCS US$0.99 / Piece US$0.99 / Piece
Min Order 1 Piece 1 PCS 1 PCS 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC
Quality Control
Product Certification ISO/RoHS/UL/IATF - - - -
Management System Certification Others - - - -
Trade Capacity
Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
Test: Aoi/Spi/X-ray;
Delivery: 7-15 Days Sample;
Packing: Carton/Custom;
Type: Rigid Circuit Board;
Dielectric: 4360g2;
Material: Hydrocarbon Ceramic-Filled Thermoset Materials;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: 4360g2;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Application: Small Cell Transceivers;
Thickness: 16 Mil;
Layer Count: 2-Layer;
Solder Mask: Green;
Type: Rigid Circuit Board;
Dielectric: RO4360;
Material: Hydrocarbon Ceramic-Filled Thermoset Materials;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: RO4360;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Application: Antennas;
Thickness: 20 Mil;
Surface Finish: Immersion Gold;
Layer Count: 2-Layer;
Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Panasonic;
Tihickness: 8mil, 10mil,12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Rogers;
Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
Supplier Name

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

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