| Specification |
Function Type: Infrared Range and Communication System, Thermal Imaging System;
Detection Type: Any Objectives;
Output Signal Type: Relay;
Production Process: Integration;
Material: Aluminum Alloy + PC;
IP Rating: IP67;
Customized: Customized;
Beams: 4-Beams;
Height: Pb3-4L15(30cm Height);
Detection Range: 20m;
Power Supply: DC12-24V;
Transmitter Operating Current: Less Than 50mA;
Receiver Operation Current: Less Than 50mA;
Response Time: 50/100/150/200ms Adjustable;
Trigger Time: One Beam or More Beam, 2s or Immediately;
Induction Method: Single Beam or Multi-Beams, (Can Set);
Working Temperature: -20 to 60;
Alarm Output: Wired Output, Relay Output 30VDC@2A, 125VAC@1A;
Output Way: Wired Transmission (No/Nc);
Rotation Angle: 180 Degrees Horizontal;
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Function Type: Thermal Imaging System;
Detection Type: T2SL Cooled Infrared Fpa;
Output Signal Type: Digital Type;
Detector Type: T2SL Cooled Infrared Fpa;
Resolution: 640×512;
Pixel Pitch: 15μm;
Netd: ≤25mk @25°c;
Spectral Band: 7.7±0.2μm~10±0.5μm;
Operability: ≥99.5%;
Cooling Time@25℃: 7min;
Brightness/Contrast Adjustment: Manual/Auto;
Reticle: Display/Blank/Move;
Digital Zoom: 1.0~8.0 Continuous Zoom (Step Size: 0.1);
Weight (Without Lens): ≤870g;
Mttf: ≥10000h;
Mirroring: Horizontal/Vertical/Diagonal;
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Function Type: Thermal Imaging System;
Detection Type: Heat Detectors;
Output Signal Type: Digital Type;
Production Process: SemiConductor Integrated;
Material: Semiconductor Material;
Customized: Customized;
Detector: Hgcdte;
Resolution: 640*512;
Pixel Pitch: 15μm;
Cooling Temperature: -20℃, -40℃;
Interface: SDI/Cameralink;
Cooling Mode: Sterling;
Operating Temperature: -40℃+70℃;
Zoom Mode: Electricity-Driven;
Power Consumption: 22W;
Input Voltage: DC 20V;
Wavelength Range: 3.7μm-4.8μm;
Dimensions: 150mm×80mm×80mm;
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Function Type: Thermal Imaging System;
Detection Type: Heat Detectors;
Output Signal Type: Digital Type;
Production Process: SemiConductor Integrated;
Material: Semiconductor Material;
Customized: Customized;
Detector: Hgcdte;
Resolution: 640*512;
Pixel Pitch: 15μm;
Cooling Temperature: -20℃, -40℃;
Interface: SDI/Cameralink;
Cooling Mode: Sterling;
Operating Temperature: -40℃+70℃;
Zoom Mode: Electricity-Driven;
Power Consumption: 22W;
Input Voltage: DC 20V;
Wavelength Range: 3.7μm-4.8μm;
Dimensions: 150mm×80mm×80mm;
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Function Type: Thermal Imaging System;
Detection Type: Heat Detectors;
Output Signal Type: Digital Type;
Production Process: SemiConductor Integrated;
Material: Semiconductor Material;
Customized: Customized;
Detector: Hgcdte;
Resolution: 640*512;
Pixel Pitch: 15μm;
Cooling Temperature: -20℃, -40℃;
Interface: SDI/Cameralink;
Cooling Mode: Sterling;
Operating Temperature: -40℃+70℃;
Zoom Mode: Electricity-Driven;
Power Consumption: 22W;
Input Voltage: DC 20V;
Wavelength Range: 3.7μm-4.8μm;
Dimensions: 150mm×80mm×80mm;
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