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Advanced Assembly
US$3.00-10.00 / Piece
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What is Multi-Layer Electronic PCBA Assembly with Advanced Custom Features

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-9 Pieces US$10.00

10+ Pieces US$3.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Communication
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Delay Pressure Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Customized
  • Transport Package Inner Vacuum Packing, Outer Carton
  • Specification Customized
  • Origin Shanghai, China
  • Surface Finished HASL, Gold Finger, OSP, Enig, Peelable
  • Layer 1-32
  • Outline Profile Rout/ V-Cut Bridge/ Stamp Hole
  • Max Production Size 600*800mm

Product Description

Product Description Product Name Custom pcba &Original IC Electronic components Brand Name PCBA Base Material FR1~FR4/Aluminum/PI/CU Board Thickness according to customer`s requirements , 0.4mm-3.2mm Layer according to customer`s requirements , 1~58Layers Certificate ISO9001 ...

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Advanced Assembly Comparison
Transaction Info
Price US$3.00-10.00 / Piece US$0.80-1.00 / Piece US$2.06-6.00 / Piece US$0.98-5.00 / Piece US$1.10-1.30 / Piece
Min Order 5 Pieces 1 Piece 10 Pieces 10 Pieces 1 Piece
Payment Terms LC, T/T, PayPal LC, T/T, D/P, PayPal, Western Union T/T T/T LC, T/T, D/P, PayPal, Western Union
Quality Control
Product Certification - - RoHS, CCC, ISO RoHS, CCC, ISO -
Management System Certification - - ISO9001:2015 ISO9001:2015 -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe Domestic Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model - - ODM, OEM ODM, OEM -
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Type: Rigid Circuit Board;
Dielectric: Rogers;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer: 4 Layers;
Thickness: 1.62mm;
Mmodel: Xceh;
Rogers: R04003;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer Count: 4layer;
Board Thickness: 1.6mm;
Board Material: Fr4;
Surface Finish: Enig/1u'';
Soldermask Color: Black;
Cooper Thickness: 1oz;
Supplier Name

Shanghai Jumptop Trading Co Ltd

Gold Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

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