| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
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Type: Flexible Circuit Board;
Dielectric: No;
Material: Polyimide;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: No;
Brand: Exceeding Electronics;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Custom PCB;
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Type: Flexible Circuit Board;
Dielectric: No;
Material: Polyimide;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: No;
Brand: Exceeding Electronics;
Technology: Lead The Industry;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB;
Service: 7*24 Hours Online;
Price: Factory Price;
|
Type: Flexible Circuit Board;
Dielectric: No;
Material: Polyimide;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: No;
Brand: Exceeding Electronics;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB;
Delivery: 5days;
Price: Factory Price;
Service: 7*24 Hours Online;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
|