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64GB DDR4 Mini PC
US$187.65-219.73 / units
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About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 units US$219.73

10-99 units US$204.65

100+ units US$187.65

Sepcifications

  • Application Field Industrial Control
  • Processor Type Intel
  • Stratification HardWare Layer
  • Range of Application General
  • Bus Type Not Bus Type
  • Certification CE, RoHS, FCC
  • Type Embedded Systems
  • Machine Word-Length 8
  • Instruction Type RISC
  • Kernel PIC
  • Transport Package Standard Color Express Box
  • Specification PC size 205*125*53mm Package size 308*206*75mm
  • Trademark HYSTOU
  • Origin Guangdong, China
  • CPU Intel Core I3-10110u
  • Warranty(Year) 3-Year
  • Hard Drive Type SSD+HDD
  • GPU Intel UHD Graphics
  • Plugs Type Us, Jp, Cn, Au, UK, EU
  • Graphics Card Chipset Integrated Card
  • RAM Type DDR4
  • OS Windows 10/11, Linux
  • Use Industrial
  • Material Aluminum Alloy
  • USB Port 2*USB 2.0 Port, 4*USB 3.0 Port
  • LAN 2*RJ45 LAN
  • Video Memory 2 GB

Product Description

Product Picture HYSTOU Fanless Industrial Mini PC Core i3 i5 i7 Rich interfaces to respond to the needs Fanless Industrial PC H6 is equipped with 6*USB, 2*COM, 2*LAN, 1*DP, 2*HD interfaces, etc. USB3.0 transmission speed is fast, which improves your work efficiency and saves your time. It ...

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64GB DDR4 Mini PC Comparison
Transaction Info
Price US$187.65-219.73 / units US$121.00-160.00 / Piece US$85.00-112.00 / Piece US$50.00-67.00 / Piece US$68.00-91.00 / Piece
Min Order 1 units 2 Pieces 2 Pieces 2 Pieces 2 Pieces
Payment Terms LC, T/T, PayPal, Western Union, Money Gram, Visa Card LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia
Annual Export Revenue - - - - -
Business Model ODM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Application Field: Industrial Control;
Processor Type: Intel;
Stratification: HardWare Layer;
Range of Application: General;
Bus Type: Not Bus Type;
Type: Embedded Systems;
Machine Word-Length: 8;
Instruction Type: RISC;
Kernel: PIC;
CPU: Intel Core I3-10110u;
Warranty(Year): 3-Year;
Hard Drive Type: SSD+HDD;
GPU: Intel UHD Graphics;
Plugs Type: Us, Jp, Cn, Au, UK, EU;
Graphics Card Chipset: Integrated Card;
RAM Type: DDR4;
OS: Windows 10/11, Linux;
Use: Industrial;
Material: Aluminum Alloy;
USB Port: 2*USB 2.0 Port, 4*USB 3.0 Port;
LAN: 2*RJ45 LAN;
Video Memory: 2 GB;
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Type: System on Module Som+ Carrier Board;
Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55);
OS: Android 13 Debian 11.6;
GPU: Mali-G610 MP4, 450 Gflops;
Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
Memory: Lpddr4 4GB/8GB/16GB/32GB;
Storage: Emmc 64GB/128GB/256GB;
Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
Audio: Can Be Customized;
Input Power: The Carrier Board Can Be Customized;
Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
Environment: Operating Temperature -20°c ~ 60°c;
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Type: System on Module Som+ Carrier Board;
Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55);
OS: Android 13 Debian 11.6;
GPU: Mali-G610 MP4, 450 Gflops;
Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
Memory: Lpddr4 4GB/8GB/16GB/32GB;
Storage: Emmc 64GB/128GB/256GB;
Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
Audio: Can Be Customized;
Input Power: The Carrier Board Can Be Customized;
Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
Environment: Operating Temperature -20°c ~ 60°c;
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Type: System on Module Som;
Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53);
OS: Android 14;
Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
Memory: Lpddr4 4GB/8GB/16GB/32GB;
Storage: Emmc 64GB/128GB/256GB;
Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
Audio: Can Be Customized;
Input Power: The Carrier Board Can Be Customized;
Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
Environment: Operating Temperature -20°c ~ 60°c;
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Type: System on Module Som+ Carrier Board;
Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53);
OS: Android 14;
GPU: Arm Mali-G52 Mc3;
Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
Memory: Lpddr4 4GB/8GB/16GB/32GB;
Storage: Emmc 64GB/128GB/256GB;
Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
Audio: Can Be Customized;
Input Power: The Carrier Board Can Be Customized;
Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
Environment: Operating Temperature -20°c ~ 60°c;
Supplier Name

Shenzhen Fannis Technology Co., Ltd

Diamond Member Audited Supplier

Shenzhen Pretech Industrial Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Pretech Industrial Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Pretech Industrial Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Pretech Industrial Co., Ltd.

Diamond Member Audited Supplier

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