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Gaming Mini PC
US$484.39-507.79 / units
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What is Hystou High-End High-Performance DDR4 Gtx1650 Desktop Computer Embedded Home Office Work Design Use Mini PC

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 units US$507.79

10-99 units US$493.58

100+ units US$484.39

Sepcifications

  • Application Field Home Appliance
  • Processor Type Intel
  • Stratification HardWare Layer
  • Range of Application General
  • Bus Type Not Bus Type
  • Certification CE, RoHS, FCC
  • Type Embedded Systems
  • Machine Word-Length 8
  • Instruction Type RISC
  • Transport Package Normal Color Express Box
  • Specification PC size 276*200*55mm Package size 390*290*106mm
  • Trademark HYSTOU
  • Origin Guangdong, China
  • CPU Intel Core I5-12450h
  • Video Card Nvidia Geforce Gtx 1650
  • Warranty(Year) 3-Year
  • Hard Drive Type SSD+HDD
  • Plugs Type Us, Jp, Cn, Au, UK, EU
  • Processor Series Intel Core I5
  • Chipset Type Intel
  • RAM Type DDR4
  • LAN Port 1* RJ45 LAN, Realtek 8168/8111
  • Case Material ABS + Aluminum Alloy
  • Use for Gaming
  • Video Memory Type Gddr5
  • After-Sales Service Return and Replacement
  • Max Memory Size 64GB
  • Memory Types 2*DDR4 So-DIMM 260 Pin

Product Description

Powerful Micro Computer 12th Gen Intel Core i5 Mini Gaming PC Product Description Unlike traditional bulky desktop gaming consoles, this mini gaming PC has a design that blends perfectly with any modern environment, whether it's a desk, living room or den. Its captivating aesthetics take your ...

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Gaming Mini PC Comparison
Transaction Info
Price US$484.39-507.79 / units US$121.00-160.00 / Piece US$85.00-112.00 / Piece US$50.00-67.00 / Piece US$68.00-91.00 / Piece
Min Order 1 units 2 Pieces 2 Pieces 2 Pieces 2 Pieces
Payment Terms LC, T/T, PayPal, Western Union, Money Gram, Visa Card LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia
Annual Export Revenue - - - - -
Business Model ODM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Application Field: Home Appliance;
Processor Type: Intel;
Stratification: HardWare Layer;
Range of Application: General;
Bus Type: Not Bus Type;
Type: Embedded Systems;
Machine Word-Length: 8;
Instruction Type: RISC;
CPU: Intel Core I5-12450h;
Video Card: Nvidia Geforce Gtx 1650;
Warranty(Year): 3-Year;
Hard Drive Type: SSD+HDD;
Plugs Type: Us, Jp, Cn, Au, UK, EU;
Processor Series: Intel Core I5;
Chipset Type: Intel;
RAM Type: DDR4;
LAN Port: 1* RJ45 LAN, Realtek 8168/8111;
Case Material: ABS + Aluminum Alloy;
Use: for Gaming;
Video Memory Type: Gddr5;
After-Sales Service: Return and Replacement;
Max Memory Size: 64GB;
Memory Types: 2*DDR4 So-DIMM 260 Pin;
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Type: System on Module Som+ Carrier Board;
Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55);
OS: Android 13 Debian 11.6;
GPU: Mali-G610 MP4, 450 Gflops;
Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
Memory: Lpddr4 4GB/8GB/16GB/32GB;
Storage: Emmc 64GB/128GB/256GB;
Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
Audio: Can Be Customized;
Input Power: The Carrier Board Can Be Customized;
Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
Environment: Operating Temperature -20°c ~ 60°c;
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Type: System on Module Som+ Carrier Board;
Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55);
OS: Android 13 Debian 11.6;
GPU: Mali-G610 MP4, 450 Gflops;
Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
Memory: Lpddr4 4GB/8GB/16GB/32GB;
Storage: Emmc 64GB/128GB/256GB;
Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
Audio: Can Be Customized;
Input Power: The Carrier Board Can Be Customized;
Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
Environment: Operating Temperature -20°c ~ 60°c;
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Type: System on Module Som;
Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53);
OS: Android 14;
Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
Memory: Lpddr4 4GB/8GB/16GB/32GB;
Storage: Emmc 64GB/128GB/256GB;
Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
Audio: Can Be Customized;
Input Power: The Carrier Board Can Be Customized;
Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
Environment: Operating Temperature -20°c ~ 60°c;
Application Field: Industrial Control;
Processor Type: ARM;
Stratification: HardWare Layer;
Range of Application: General;
Type: System on Module;
Kernel: PIC;
Product Type: System on Module Som+ Carrier Board;
Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53);
OS: Android 14;
GPU: Arm Mali-G52 Mc3;
Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
Memory: Lpddr4 4GB/8GB/16GB/32GB;
Storage: Emmc 64GB/128GB/256GB;
Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1;
Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
Audio: Can Be Customized;
Input Power: The Carrier Board Can Be Customized;
Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
Environment: Operating Temperature -20°c ~ 60°c;
Supplier Name

Shenzhen Fannis Technology Co., Ltd

Diamond Member Audited Supplier

Shenzhen Pretech Industrial Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Pretech Industrial Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Pretech Industrial Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Pretech Industrial Co., Ltd.

Diamond Member Audited Supplier

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