| Specification |
After-sales Service: Yes;
Function: 1;
Demoulding: Automatic;
Condition: New;
Warranty: 24 Months;
Automatic Grade: Automatic;
Installation: Vertical;
Driven Type: Electric;
Mould Life: >1,000,000 Shots;
Maximum Board Size(X X Y): 450mm * 350mm;
Repetition Accuracy: 10 Um;
Printing Accuracy: 15 μm;
Field of View: 6.4mm X 4.8mm;
Stencil Size: 470mm X 370mm~737 mm X 737 mm;
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After-sales Service: Online Suppord;
Function: High Precision and Steady;
Demoulding: Pull Core;
Condition: New;
Warranty: 12 Months;
Automatic Grade: Automatic;
Installation: Desktop;
Driven Type: Electric;
Mould Life: 300,000-1,000,000 Shots;
Wire Size: 0.02~1.2mm;
Speed: 300 ~8570rpm;
Winding Motor: DC Brushless Motor;
Memory Capacity: 999 Steps;
Power Source: AC220V/110V +10%, 50/60 Hz.;
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After-sales Service: Online Suppord;
Function: High Precision and Steady;
Demoulding: Pull Core;
Condition: New;
Warranty: 12 Months;
Automatic Grade: Automatic;
Installation: Desktop;
Driven Type: Electric;
Mould Life: 300,000-1,000,000 Shots;
Wire Size: 0.02~1.2mm;
Speed: 300 ~8570rpm;
Winding Motor: DC Brushless Motor;
Memory Capacity: 999 Steps;
Power Source: AC220V/110V +10%, 50/60 Hz.;
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After-sales Service: Online Service;
Function: High Temperature Resistance;
Demoulding: Pull Core;
Condition: New;
Warranty: 12 Months;
Automatic Grade: Automatic;
Installation: Vertical;
Driven Type: Electric;
Mould Life: 300,000-1,000,000 Shots;
Product Name: Laser Annealing Machine;
Feature 1: UV Laser with Low Penetration Depth;
Feature 2: Low Dopant Diffusion;
OEM/ODM Service: Provided;
Wafer Size: 6 Inch, 8 Inch;
Junction Depth: ≤50nm;
Impurity Peak Diffusion Depth: ≤5nm;
RS Non-Uniformity: <2% (Wiw/Wtw);
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After-sales Service: Yes;
Function: Abrasion Resistance, High Temperature Resistance;
Demoulding: Pull Core;
Condition: New;
Warranty: 12 Months;
Automatic Grade: Automatic;
Installation: Vertical;
Driven Type: Electric;
Mould Life: 300,000-1,000,000 Shots;
Control System: PC+PLC;
Wafer Type: Taiko and Non-Taiko Wafers;
Wafer Size: 8", 12", 8/12 Compatible;
Wafer Thickness (Taiko): 8" ≥ 100μm, 12" ≥ 150μm;
Tape Specification: Pyrolytic or UV Bg Film;
Factory Integration: Secs/Gem Supported;
Power Supply: AC220V, 12A;
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