| Specification |
Max. PCB Size (X X Y): L 510 * W 510 mm;
Min. PCB Size (Y X X): L 50 * W 50;
Fov: 48.6 * 36.4 mm;
3D Projectors: 4 (8 Optional);
Maximum 3D Detectable Component: Standard 18 mm (Z-Axis Head Lift up to 35 mm);
Operating System: Window 10;
Condition: New;
Warranty: 12 Months;
Automatic Grade: Automatic;
Installation: Vertical;
Driven Type: Electric;
Mould Life: >1,000,000 Shots;
After-sales Service: Technical Support, Maintenance Services;
Demoulding: Na;
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Type: AOI (Automated Optical Inspection);
Inspection Technology: Gerber;
Resolution: 5μm;
Lighting System: Multi-Angle LED;
Weight Capacity: 5kg;
Placement of Steel Mesh: Natural Placement of The Glass Platform;
Maximum Measurement Range: 570*570mm;
Gerber File Read Time: up to 200,000 Holes: 5s;
Gerber File Operation Response Time: up to 200,000 Holes: 0.3s;
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Type: AOI (Automated Optical Inspection);
Inspection Technology: Gerber;
Resolution: 5μm;
Lighting System: Multi-Angle LED;
Weight Capacity: 5kg;
Placement of Steel Mesh: Natural Placement of The Glass Platform;
Maximum Measurement Range: 570*570mm;
Gerber File Read Time: up to 200,000 Holes: 5s;
Gerber File Operation Response Time: up to 200,000 Holes: 0.3s;
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Type: Fully Automatic COB LED Strip Full Production Line;
Inspection Technology: 3D Laser Scanning;
Resolution: 1μm (X-Ray);
Lighting System: Multi-Angle LED;
Magnification: 10X~50X;
Application: Automotive Electronics;
Applicable Chips: COB LED Chips (0.1W-0.5W/PC, 300-768PCS/M);
Line Speed: 5-15m/Min (Adjustable, Max 20m/Min);
Die Bonding Precision: ±0.01mm;
Testing Function: Visual Inspection, Electrical Performance Test, Br;
Wire Bonding Precision: ±0.008mm;
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Type: AOI (Automated Optical Inspection);
Inspection Technology: Gerber;
Resolution: 5μm;
Lighting System: Multi-Angle LED;
Weight Capacity: 5kg;
Placement of Steel Mesh: Natural Placement of The Glass Platform;
Maximum Measurement Range: 570*570mm;
Gerber File Read Time: up to 200,000 Holes: 5s;
Gerber File Operation Response Time: up to 200,000 Holes: 0.3s;
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