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Factory Price OEM Reverse PCBA Engineering for Mobile Phone Circuit Board Assembly Manufacture Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

10 Pieces US$1.60 / Piece

Sepcifications

  • Metal Coating Copper
  • Mode of Production SMT
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, CCC, ISO
  • Customized Customized
  • Condition Used
  • Transport Package Pallets
  • Specification 600*600
  • Trademark OEM ODM
  • Origin China
  • Product Name OEM Reverse PCBA Engineering for Mobile Phone
  • Shipment Way by Air by Sea
  • Payment Way Tt
  • Min.Pin Space of IC 0.3mm
  • Min. Space of BGA +/- 0.3mm
  • Max.Precision of IC Assembly 0.03mm
  • SMT Capacity >2 Million Points/Day
  • DIP Capacity >100K Parts/Day
  • Electronic 100kmonth
  • Test  100% Aoi Testing

Product Description

OEM reverse PCBA engineering for mobile phone circuit board assembly manufacture Company Profile Shenzhen Hongzhou Smart Technology Co.,Ltd is a factory offering EMS (Electronic Manufacturing service) manufacturing.The main business of our factory is as below: 1. High Quality PCBA OEM &ODM ...

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PCBA Assembly Comparison
Transaction Info
Price US$1.60 / Piece US$0.01 / Piece US$0.01 / Piece US$3,000.00-6,000.00 / Piece US$25,000.00-40,000.00 / Piece
Min Order 10 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment - -
Quality Control
Product Certification RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO, CE RoHS, CCC, ISO, CE
Management System Certification ISO9001:2015 - - - -
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM - - Own Brand, ODM, OEM Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: OEM Reverse PCBA Engineering for Mobile Phone;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Technology: SMD, Tht, Double-Sided SMT Assembly, Fine Pitch to;
SMT Line: 11 SMT Lines;
SMT Capability: 20, 000, 000 Points Per Day;
DIP Capability: 300, 000 Points Per Day;
Metal Coating: Stainless Steel;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Modle: Mr-30;
Air Supply: 0.5~0.7MPa;
Power Supply: AC220V, 1A, 100W;
Clean Liquid: Purified Water or Di Water;
Clean Time: 2~3min;
Day Time: 1~3min;
Jet Pressure: ≤0.4MPa;
Machine Weight: 35kg;
Metal Coating: Cast Iron;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Measurement Principle: Sine White Projection PMP Inspection;
Lens Resolution: 42mmx42mm (Based on 6. 5 M Pixel / 16.5um Resoluti;
Accuracy: Xy(Resolution):±1um;
Inspection Speed: 0.45 Sec/Fov;
Mark-Point Detection Time: 0.5sec/Piece;
Max.PCB Size: 510*460mm;
PCB Thickness: 0.3 ~ 6.0mm;
PCB Warpage: ±2.0mm;
PCB Weight: 4kg;
PCB Height: Top:50mm;
Conveyor Height: 900±20mm;
Conveyor Direction: L ~R or R ~L;
Power: AC220 50/60Hz,5A;
Compressed Air: 0.4 ~ 0.6MPa;
Weight: 1100kg;
Supplier Name

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Dongguan Mingrui Technology Co., Ltd.

Gold Member Audited Supplier

Dongguan Mingrui Technology Co., Ltd.

Gold Member Audited Supplier

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