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Medical PCBA Manufacturer Motherboard PCB Electronic Printed Circuit Board Assembly for Computer Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

9,999 Pieces US$12.00

10,000+ Pieces US$3.50

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Complex
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Fexible
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Brand Hongzhou
  • Transport Package Antistatic Package+Plastic Box and Carton Box
  • Trademark Customized
  • Origin Shenzhen
  • PCBA-Testing X-ray, Aoi

Product Description

Product Description Layer count 1-48 layers Material FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers Copper thickness 1/2oz,1oz,2oz,3oz,4oz,5oz Board thickness 8-236mil(0.2-6.0mm) Min.line width/space 3/3 mil(75/75um) Min. drill size 8 mil(0.2mm) Min. HDI laser drill size 3 ...

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PCBA OEM Comparison
Transaction Info
Price US$3.50-12.00 / Piece US$0.10 / Piece US$0.10-10.00 / piece US$0.10-80.00 / Piece US$0.01-10.00 / piece
Min Order 9,999 Pieces 1 Piece 1 piece 1 Piece 1 piece
Payment Terms T/T LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification - - - UL,ISO9001&ISO14001,SGS,RoHS Report -
Management System Certification ISO9001:2015 - - - -
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hongzhou;
PCBA-Testing: X-ray, Aoi;
Dielectric: FR-4;
Material: Kingboard;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Kingboard;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Buried Via: Yes;
Blind Via: Yes;
Impedance Control: Yes;
Filled Via: Expoxy Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.6mm;
Copper Thickness: 35 Um;
Surface Finish: Enig;
Solder Mask: Green;
Legend: White;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Layers: 1-20layers;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layers: 8;
Board Thickness: 1.6mm;
Inner Copper: 35um;
Outer Copper: 35um;
Surface Finish: Enig;
Solder Mask: Blue;
Legend: White;
Mini Holes: 0.1mm;
Mini Line Width: 0.1mm;
Supplier Name

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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