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High-Performance Aftermarket Matrix Beam PCB for Thermoelectric Applications Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.80-2.60 / Piece

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric MCPCB\Fr4\Bt
  • Flame Retardant Properties Customized
  • Mechanical Rigid Rigid
  • Processing Technology Delay Pressure Foil
  • Base Material Double-Sided/Multilayer Aluminum/Copper
  • Insulation Materials Customized
  • Model PCB
  • Brand Hongyu
  • Transport Package Sea/Land/Air Freight
  • Specification customized
  • Trademark hongyu
  • Origin Jiangxi, China
  • Board Thickness 0.8mm
  • Metal Core PCB T2 High Conductivity Copper(0.8mm)
  • Thermal Conductivity 398W/M·K (Dielectric Layer)
  • Copper Foil 35/35μm
  • Tg 150°C

Product Description

Product Description Specification NO. Project Conventional process capability Extreme process capability advantage 1 layer 1-10 10 2 Product Type MCPCB\FR4\BT MCPCB\FR4\BT * 3 Surface Treatment HASL/OSP/ENIG/Immersion Silver (IAg)/ Immersion Tin (Sn)/Gold Plating HASL/OSP/ENIG/Immersion Silver ...

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PCB Comparison
Transaction Info
Price US$0.80-2.60 / Piece US$72.00-88.00 / Piece US$2.50 / Piece US$1.60 / Piece US$0.031-0.42 / Piece
Min Order 1 Piece 1,000 Pieces 1 Piece 1 Piece 1 Piece
Payment Terms T/T, Western Union T/T, PayPal, Western Union, Money Gram T/T, PayPal, Western Union T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Management System Certification ISO14001, ISO9001:2015, ISO45001:2018, Others - - - -
Trade Capacity
Export Markets Southeast Asia/ Mideast, Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: PCB;
Brand: Hongyu;
Board Thickness: 0.8mm;
Metal Core PCB: T2 High Conductivity Copper(0.8mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 35/35μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Yingxin;
Weight: 117g;
Operating Voltage: 100V-240V;
Bluetooth Range: 30m;
Load Power: 2000W;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: R-Creation;
PCB: 260mm*150mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: R-Creation;
PCB: 140mm*210 Mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Copper Thickness: 1oz;
Min Hole: 0.2mm;
Min Width: 0.12mm;
Min Space: 0.12mm;
Supplier Name

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen XinYingxin Electronics Technology Co., Ltd.

Gold Member Audited Supplier

R-CREATION Technology Co., Ltd.

Gold Member Audited Supplier

R-CREATION Technology Co., Ltd.

Gold Member Audited Supplier

Shenzhen Okey Circuit Co., Ltd.

Diamond Member Audited Supplier

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