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Custom Thermal Management Board for PCB High-Power LED Lighting Applications

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.80-2.60 / Piece

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric MCPCB\Fr4\Bt
  • Application New Energy Vehicle Electronic Control Board
  • Flame Retardant Properties Customized
  • Mechanical Rigid Rigid
  • Processing Technology Delay Pressure Foil
  • Base Material Double-Sided/Multilayer Aluminum/Copper
  • Insulation Materials Customized
  • Brand Hongyu
  • Transport Package Sea/Land/Air Freight
  • Specification customized
  • Trademark hongyu
  • Origin Jiangxi, China
  • Board Thickness 1.6mm
  • Metal Core PCB T2 High Conductivity Copper(1.6mm)
  • Thermal Conductivity 398W/M-K+Non Thermoelectric Separation Ar
  • Copper Foil 70μm
  • Tg 150°C

Product Description

Specification NO. Project Conventional process capability Extreme process capability advantage 1 layer 1-10 10 2 Product Type MCPCB\FR4\BT MCPCB\FR4\BT * 3 Surface Treatment HASL/OSP/ENIG/Immersion Silver (IAg)/ Immersion Tin (Sn)/Gold Plating HASL/OSP/ENIG/Immersion Silver (IAg)/ Immersion Tin ...

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Custom Thermal Board Comparison
Transaction Info
Price US$0.80-2.60 / Piece US$0.01-150.00 / Piece US$0.01-150.00 / Piece US$0.01-150.00 / Piece US$0.01-150.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Management System Certification ISO14001, ISO9001:2015, ISO45001:2018, Others - - - -
Trade Capacity
Export Markets Southeast Asia/ Mideast, Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.6mm;
Cooper Thickness: 1 Oz;
Solder Mask: Green;
Silk: White;
Surface Finished: Enig;
Spec: High Density Interconnect PCB;
Precision: 4mil;
Tolerance: 0.01mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Remark: PCB Board;
Layer: 4;
Surface Finish: HASL;
Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers;
Board Thickness: 0.20mm-8.00mm;
Min Line: 0.075mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: N/a;
Remark: PCB Board;
Layer: 4;
Surface Finish: Immersion Gold;
Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers;
Board Thickness: 0.20mm-8.00mm;
Min Line: 0.075mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Remark: PCB Board;
Layer: 6;
Surface Finish: HASL;
Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers;
Board Thickness: 0.20mm-8.00mm;
Min Line: 0.075mm;
Supplier Name

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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