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Premium Nvidia-Approved Thermal PCB with Copper Map Technology Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.80-2.60 / Piece

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric MCPCB\Fr4\Bt
  • Flame Retardant Properties Customized
  • Mechanical Rigid Rigid
  • Processing Technology Delay Pressure Foil
  • Base Material Double-Sided/Multilayer Aluminum/Copper
  • Insulation Materials Customized
  • Model PCB
  • Brand Hongyu
  • Transport Package Sea/Land/Air Freight
  • Specification customized
  • Trademark hongyu
  • Origin Jiangxi, China
  • Board Thickness 0.8mm
  • Metal Core PCB T2 High Conductivity Copper(0.8mm)
  • Thermal Conductivity 398W/M·K (Dielectric Layer)
  • Copper Foil 35/35μm
  • Tg 150°C

Product Description

Product Description Specification NO. Project Conventional process capability Extreme process capability advantage 1 layer 1-10 10 2 Product Type MCPCB\FR4\BT MCPCB\FR4\BT * 3 Surface Treatment HASL/OSP/ENIG/Immersion Silver (IAg)/ Immersion Tin (Sn)/Gold Plating HASL/OSP/ENIG/Immersion Silver ...

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PCB Comparison
Transaction Info
Price US$0.80-2.60 / Piece US$0.10-5.00 / Piece US$0.10-5.00 / Piece US$0.10 / Piece US$0.15-10.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Management System Certification ISO14001, ISO9001:2015, ISO45001:2018, Others - - - -
Trade Capacity
Export Markets Southeast Asia/ Mideast, Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: PCB;
Brand: Hongyu;
Board Thickness: 0.8mm;
Metal Core PCB: T2 High Conductivity Copper(0.8mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 35/35μm;
Tg: 150°C;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green / Black / Blue / Red / Yellow;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 0.5mm / 0.8mm / 1.6mm Custom;
Custom: OEM / ODM;
Copper: 0.5oz / 18um, 2oz / 70um;
Layers: 2 Layers, 4 Layers, Custom;
Legend: White;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green / Black / Blue / Red / Yellow;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 0.5mm / 0.8mm / 1.6mm Custom;
Custom: OEM / ODM;
Copper: 0.5oz / 18um, 2oz / 70um;
Layers: 2 Layers, Custom;
Legend: White;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: No;
PCB Material: Fr4;
PCB Layer: 2;
PCB Impedance Control: No;
PCB Buried& Blind Vias: No;
PCB Copper Thickness: 35um;
Hard Gold: N/a;
Min Line/Width: 6mil;
Min Drill: 0.15mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Abis;
Layer: 2L;
Solder Mask: Green/Blue/Red;
Surface Finish: HASL-Lead Free;
Legend Color: White;
Board Thickness: 1.6mm;
out Copper Thickness: 35um;
Inner Copper Thickness: 70um;
Raw Material: Fr4;
Supplier Name

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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