| Specification |
Type: Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Material: Customized;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: FR-4;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Printed Circuit Board Double-Sided PCB Fabrication;
MOQ: 1 PCS;
Layer: 2 Layer;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Board Thickness: 0.2mm-4mm;
Copper Thickness: 0.5oz, 1oz, 2oz;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
Service: Printed Circuit Board, PCB, PCBA, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: Medical, Industrial, Control Board, CE;
Delivery: PCB, 3-5 Days;PCBA, 2-3weeks;
Product Name: Printed Circuit Board Double-Sided PCB Fabrication;
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Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
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Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
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Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Flame Retardant Properties: V0;
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