| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hometech;
Delivery: 2 Weeks;
PCBA QC: X-ray,Aoi Test,Function Test(100% Test);
|
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: V1;
Dielectric: CEM-1;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Delay Pressure Foil;
Application: Medical Instruments;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Okey;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: QA Inspection and Ect.;
Order Qty: No Limited;
Condition: New;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White and Ect.;
Surface Finishedc: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: AIN;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Okey;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: QA Inspection and Ect.;
Order Qty: No Limited;
Condition: New;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White and Ect.;
Surface Finishedc: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
|
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: V1;
Dielectric: CEM-1;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Delay Pressure Foil;
Application: Medical Instruments;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Okey;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: QA Inspection and Ect.;
Order Qty: No Limited;
Condition: New;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White and Ect.;
Surface Finishedc: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
|
Type: Flexible Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Juki;
Composition: Hardware;
Property: High and Low Temperature Lubricating Oil;
Shape: Solid;
|
