Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging Video
Price
Min. Order Reference FOB Price
1 Piece US$7,000.00-70,000.00 / Piece
Sepcifications
- After-sales Service Free Training
- Condition New
- Speed Super High Speed
- Precision High Precision
- Certification RoHS, CE
- Warranty 24 Months
- Automatic Grade Automatic
- Type Ultra High-speed Chip Mounter
- Transport Package Wooden Box by Sea Shipping
- Specification standard package
- Trademark Himalaya
- Origin China
- Configuration Inline or Standalone
- Communication TCP/IP
- Power Supply 220V
- Chip Size Range 0.8–25 mm
- Wafer Support 8-Inch / 12-Inch
- Substrate/Leadframe Width 30–120 mm
- Substrate/Leadframe Length 150–300 mm
- Bond Force Range 30 GF – 4000 GF
- Machine Dimensions (W×d×h) 2170 mm × 1450 mm × 1800 mm
- Weight 1800kg
Product Description
Die Bonder Chip Bonding Equipment (Die Bonder) Also known as a die bonder, it is a semiconductor packaging device used to mount and attach chips onto substrate packages. It employs various methods such as using nozzles to pick-and-place flipped chips onto substrates, then connecting the chip ...
