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High-Performance Machine
US$100,000.00-1,000,000.00 / Piece
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What is Advanced Jdh-400 Flip Chip Bonding Machine for Precision IC Assembly

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-1,000,000.00 / Piece

Sepcifications

  • After-sales Service Provide
  • Warranty 12 Months
  • Transport Package Customized or Wooden Box Packaging
  • Specification Standard Specifications
  • Trademark Himalaya
  • Origin China
  • Product Name Flip Chip Bonding Machine
  • Application Large-Scale Integrated Circuit Device
  • Certification ISO
  • Condition New

Product Description

Product Description The flip chip bonding machine is mainly used in the flip welding process of large-scale integrated circuit device manufacturing to complete the flip interconnection between chip and substrate, so that the package has better circuit characteristics of high ...

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High-Performance Machine Comparison
Transaction Info
Price US$100,000.00-1,000,000.00 / Piece US$55.00-70.00 / Piece US$24,800.00-29,000.00 / Piece US$5,990.00-18,960.00 / Piece US$27,800.00-34,400.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification ISO - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets Europe North America, Europe, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM Own Brand, ODM, OEM - - -
Average Lead Time Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
After-sales Service: Provide;
Warranty: 12 Months;
Product Name: Flip Chip Bonding Machine;
Application: Large-Scale Integrated Circuit Device;
Condition: New;
After-sales Service: Online Video Support;
Warranty: 1 Year;
Product Name: Air Compressor Accessories;
Use: Laser Cutting Machine;
Advantages: Industrial Grade;
Working Hours: 7X24 Hours;
After-sales Service: Online;
Warranty: 1 Year;
After-sales Service: Online;
Warranty: 1 Year;
After-sales Service: Online;
Warranty: 1 Year;
Supplier Name

Jiangsu Himalaya Semiconductor Co., Ltd.

Gold Member Audited Supplier

Demark (Wuhan) Technology Co., Ltd

Diamond Member Audited Supplier

TANG CHENG INTERNATIONAL TRADE CO., LTD.

Diamond Member Audited Supplier

TANG CHENG INTERNATIONAL TRADE CO., LTD.

Diamond Member Audited Supplier

TANG CHENG INTERNATIONAL TRADE CO., LTD.

Diamond Member Audited Supplier

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