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Intelligent Control Bonder
US$100,000.00-1,000,000.00 / Piece
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What is Advanced Precision Wafer Die Bonder with Smart Control Features

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-1,000,000.00 / Piece

Sepcifications

  • After-sales Service Provided
  • Condition New
  • Speed High Speed
  • Precision High Precision
  • Certification ISO
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Transport Package Customized or Wooden Box Packaging
  • Specification Standard Specifications
  • Trademark Himalaya
  • Origin China
  • Product Name Semiconductor Equipment
  • Feature 1 Guaranteed Quality
  • Feature 2 Customized According to Needs
  • After-Sale Service Provided

Product Description

Product Description DA801 IC Linear High-speed Die Attach Wafer size: 6"- 8"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for different kinds of lead frames &substrates; High-precision wafer table with highly ...

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Intelligent Control Bonder Comparison
Transaction Info
Price US$100,000.00-1,000,000.00 / Piece US$100,000.00-105,000.00 / Piece US$155.00-160.00 / Piece US$80,000.00-85,000.00 / Piece US$2,500.00-2,950.00 / Piece
Min Order 1 Piece 1 Piece 50 Pieces 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification ISO - CCC, ISO, CE - CCC, PSE, ISO, CE
Management System Certification - - - - -
Trade Capacity
Export Markets Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Domestic
Annual Export Revenue - - - - -
Business Model ODM, OEM - ODM, OEM - ODM, OEM
Average Lead Time Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
After-sales Service: Provided;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Product Name: Semiconductor Equipment;
Feature 1: Guaranteed Quality;
Feature 2: Customized According to Needs;
After-Sale Service: Provided;
Condition: New and Used;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
PCB Inspection Area: 50 mm X50 mm to 480 mm X460 mm;
Height Resolution: +-3um;
Max Component Height: 5mm;
Fov Field of View: 58.56mmx58.56mm;
PCB Clearance: 45mm;
PCB Thickness Range: Standard:0.5mm-5mm;
Weight: Approx.950kg;
Dimension W X D X H: 1, 080X1, 470X1, 560mm;
After-sales Service: Technical Support;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Condition: New and Used;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
PCB Inspection Area: 50 mm X50 mm to 510 mm X460 mm;
Height Resolution: +-3um;
Max Component Height: 5mm;
Fov Field of View: 58.56mmx58.56mm;
PCB Clearance: 45mm;
PCB Thickness Range: Standard:0.5mm-3mm;
Weight: Approx1.200kg;
Dimension W X D X H: 1, 250X1, 500X1, 600mm;
After-sales Service: Technical Support;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Model: Khy-M88c0-00;
MOQ: 1PCS;
Delivery: by Air/Sea/Land;
Express: FedEx/UPS/TNT/DHL;
Lead Time: 3 Days;
Supplier Name

Jiangsu Himalaya Semiconductor Co., Ltd.

Gold Member Audited Supplier

MERAIF LIMITED

Gold Member Audited Supplier

Shenzhen Tuoxing Electromechanical Equipment Co., Ltd.

Diamond Member Audited Supplier

MERAIF LIMITED

Gold Member Audited Supplier

Shenzhen Tuoxing Electromechanical Equipment Co., Ltd.

Diamond Member Audited Supplier

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