| Specification |
After-sales Service: 24 Hours' on Line Service;
Application: Electrical & Electronics;
Output: Max 120V/30A Per Phase;
Frequncy: DC--3000Hz;
AC Accuracy: 0.2%;
Resolution: 4 Ma;
Digital Input: 10 *10-250VDC or Free Contact;
Digital Output: 8*AC(0.5A,250V) / 8 * DC(0.5A,60V);
PC Control: Available;
Volgage Output: 120V Per Phase;
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After-sales Service: Yes;
Application: Industrial;
Frequency Range: 76-81GHz;
Application Scope: Corrosive Liquid, Stirring, Condensation;
Measurement Range: 0-120m;
Process Temperature: -40~120℃;
Process Pressure: 0~1.0MPa;
Measurement Accuracy: ±3.0mm;
Antenna Type: 3°;
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After-sales Service: All Life-Time Service;
Application: Analyser;
Diffraction Mode: Single Diffraction;
Detection Precision: Single Diffraction: +-30s(or +-0.0083 Degree);
Acceptance System: Scintillation Counter;
X-ray Tube Current Intensity: 0-1.0mA;
Display System: Degree, Minute and Second Display;
Measured Workpiece Size: 6 Inch, 8 Inch, 12 Inch;
Power Supply: Single Phase AC220V Supply,Rated Current 2.3A;
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After-sales Service: 24 Hour Service;
Application: Electrical & Electronics;
Accuracy Class: 0.05%, 0.1%;
Standard: IEC 61010-1:2001;
AC Voltage Output: 57.7V/100V/220V/380V; Range Switch Automatically(M;
AC Current Output: 0.2A, 1A, 5A, 20A, 100A; Range Switch Automaticall;
Power Output: 0.05% Rg, 0.1% Rg;
Phase Angle: 0.000°-359.999°;
Power Factor: -1.0000 ~ 0 ~ +1.0000;
Frequency: 40.000-70.000 Hz;
Harmonic Accuracy: 2-63times;
Communication Port: RS232;
PC Control Software: Optional;
Isolation Protection: IEC 61010-1:2001;
Weight (Kg): Less Than 450; 120;
Dimensions (W×D×H)(mm): 893X766X1924; 800 X600X1200;
Working Temperature: 0°C to 50°C;
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After-sales Service: All Life-Time Service;
Application: Analyser;
Diffraction Mode: Dual-Set X-ray Measurement System;
Detectioner: High-Sensitivity Scintillation Detector;
Orientation Precision: +-30";
Automatic Function: Fully Automatic Orientation, Measurement, Rotation;
Crystal Rod Positioning: Infrared Positioning + Laser Automatic Positioning;
Mechanical Control: The Dual-Axis Mechanical Hand Rotates to Correct T;
Bonding Pressure Control: Adjustable Pressure Range: 50-200n;
Adhesive Bonding Method: Automatic Pulse-Type Adhesive;
Base Compatibility: Adaptive Material Holder for Wire Cutting Machine;
Operation Interface: Selecting Touch Screen, Anti-Misoperation Design;
Memory Function: Device Parameter Memory, No Need for Repeated Cali;
Real-Time Monitoring: X/Y Axis Deviation Angle, Bonding Pressure;
False Alarm: Automatic Alarm for Operational Errors or Exceedin;
Data Management: The Internal Database Stores Process Parameters.;
Remote Support: Remote Data Analysis and Fault Diagnosis;
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